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Substrate Processing Apparatus And Substrate Processing Method

A technology of a substrate processing device and a substrate processing method, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of inability to obtain removal performance, and achieve the effect of sufficient removal performance.

Active Publication Date: 2016-11-23
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of polymer removal, sufficient removal performance cannot be obtained only by the method of Patent Document 1

Method used

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  • Substrate Processing Apparatus And Substrate Processing Method
  • Substrate Processing Apparatus And Substrate Processing Method
  • Substrate Processing Apparatus And Substrate Processing Method

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Experimental program
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Embodiment Construction

[0024] figure 1 It is a figure which shows the schematic structure of the substrate processing system of this embodiment. Hereinafter, in order to clarify the positional relationship, the X-axis, Y-axis, and Z-axis orthogonal to each other are defined, and the positive direction of the Z-axis is assumed to be vertically upward.

[0025] Such as figure 1 As shown, a substrate processing system 1 has an input and output station 2 and a processing station 3 . The input / output station 2 and the processing station 3 are arranged adjacently.

[0026] The input / output station 2 has a carrier placement unit 11 and a transport unit 12 . A plurality of carriers C that accommodate a plurality of wafers W in a horizontal state are placed on the carrier placement unit 11 .

[0027] The transfer unit 12 is provided adjacent to the carrier placement unit 11 , and a substrate transfer device 13 and a delivery unit 14 are provided inside the transfer unit 12 . The substrate transfer dev...

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PUM

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Abstract

Disclosed are a substrate processing apparatus and a substrate processing method. A full removing performance is obtained when the droplets of a chemical solution formed by mixing a gas and a chemical liquid are used to remove a polymer attached to a substrate. The substrate processing apparatus includes a first nozzle that ejects droplets of a chemical liquid toward a front surface of a substrate, the droplets being formed by mixing a gas supplied by a gas supply mechanism and a heated chemical liquid supplied by a heated chemical liquid supply mechanism with each other, and a second nozzle that ejects the heated deionized water supplied by the heated deionized water supply mechanism toward the rear surface of the substrate. The first nozzle supplies the droplets to the front surface of the substrate heated from the rear surface thereof by the heated deionized water supplied from the second nozzle.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate by discharging droplets of a chemical solution generated by mixing a chemical solution and a gas onto a substrate. Background technique [0002] In the manufacturing process of semiconductor devices, the cleaning process can be performed by combining a chemical solution such as SC-1 (mixed solution of ammonia water and hydrogen peroxide water) with the flow of gas and spraying it on the surface of a substrate such as a semiconductor wafer. Contaminants such as particles and polymers attached to the surface of the substrate are removed. When performing this cleaning process using a single-sheet cleaning apparatus, the substrate is held on a substrate holder called a spin chuck, and the substrate is rotated around a vertical axis. A chemical solution is supplied to the substrate from a nozzle located above the rotating substrate...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02057H01L21/67023H01L21/67017H01L21/68792H01L21/67051H01L21/02041H01L21/02052H01L21/324H01L21/54H01L21/67098H01L21/67248H01L21/68764H01L21/6708
Inventor 石田省贵福井祥吾篠原英隆
Owner TOKYO ELECTRON LTD