Release soft substrate and manufacturing method thereof
A technology of flexible substrates and manufacturing methods, applied in the direction of sustainable manufacturing/processing, climate sustainability, final product manufacturing, etc., can solve problems such as high cost and cumbersome production procedures
Active Publication Date: 2016-11-23
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AI-Extracted Technical Summary
Problems solved by technology
The invention provides a release soft substrate and a manufacturing method thereof. The release soft substrate comprises a supporting carrier, a release layer and a polyimide layer. The release layer is adhered to the supporting carrier and comprises polyimide, an adhesive agent and a release agent, the polyimide, the adhesive agent and the release agent form a main structure of the release layer, the polyimide is formed by reaction of diamine and dianhydride, and the adhesive agent is used for improving adhesion of the release layer and the supporting carrier. The polyimide layer is formed by reaction of diamine and dianhydride and adhered to the release layer. The release agent is used for improving release force of the polyimide layer and the release layer to realize that adhesion of the release layer and the supporting carrier is higher than that of the polyimide layer and the release layer while the polyimide layer can be stripped off the release layer which is still adhered to the supporting carrier.
Final product manufactureSolid-state devices +4
- Experimental program(8)
- Comparison scheme(5)
- Effect test(1)
|Peel strength||<= 0.1||kgf/cm|
Description & Claims & Application Information
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