Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Release soft substrate and manufacturing method thereof

A technology of flexible substrates and manufacturing methods, applied in the direction of sustainable manufacturing/processing, climate sustainability, final product manufacturing, etc., can solve problems such as high cost and cumbersome production procedures

Active Publication Date: 2016-11-23
TAIMIDE TECH
View PDF14 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned flexible substrate with a release layer and its manufacturing method, when it wants to make a flexible substrate, must first make a release layer, the manufacturing process is more complicated and the cost is higher.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Release soft substrate and manufacturing method thereof
  • Release soft substrate and manufacturing method thereof
  • Release soft substrate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Preparation of the releasable flexible substrate of the present invention and its manufacturing method.

[0033]

[0034] Preparation of the first polyamic acid solution

[0035] Put 52.63 grams of ODA and 440 grams of DMAc as a solvent into a three-necked bottle, and then add 57.4 grams of PMDA after stirring until completely dissolved, wherein the monomer accounts for 20 wt% of the total weight of the reaction solution. Then, keep stirring at 25° C. and react for 25 hours. After the reaction, 2 wt % of silane compound and 20 wt % of fluorine-containing filler are added to obtain the first polyamic acid solution.

[0036] Preparation of the second polyamic acid solution

[0037]Put 71.67 g of TFMB and 412.5 g of DMAc as a solvent into a three-neck flask, stir until completely dissolved, then add 65.84 g of BPDA, wherein the monomer accounts for 25 wt% of the total weight of the reaction solution. Then, the second polyamic acid solution was obtained by continuously ...

Embodiment 2

[0043] The steps of Example 1 were repeated, but the components of the first polyamic acid solution were changed to 5wt% silane compound and 20wt% fluorine-containing filler.

Embodiment 3

[0045] The steps of Example 1 were repeated, but the components of the first polyamic acid solution were changed to 5 wt% silane compound and 5 wt% fluorine-containing filler.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Peel strengthaaaaaaaaaa
Login to View More

Abstract

The invention provides a release soft substrate and a manufacturing method thereof. The release soft substrate comprises a supporting carrier, a release layer and a polyimide layer. The release layer is adhered to the supporting carrier and comprises polyimide, an adhesive agent and a release agent, the polyimide, the adhesive agent and the release agent form a main structure of the release layer, the polyimide is formed by reaction of diamine and dianhydride, and the adhesive agent is used for improving adhesion of the release layer and the supporting carrier. The polyimide layer is formed by reaction of diamine and dianhydride and adhered to the release layer. The release agent is used for improving release force of the polyimide layer and the release layer to realize that adhesion of the release layer and the supporting carrier is higher than that of the polyimide layer and the release layer while the polyimide layer can be stripped off the release layer which is still adhered to the supporting carrier.

Description

technical field [0001] The invention relates to a detachable flexible substrate and a manufacturing method thereof, in particular to a flexible substrate applied to electronic components. The flexible substrate can be peeled off from a supporting carrier to obtain a flexible substrate with electronic components. substrate. Background technique [0002] Existing flat-panel displays use thick and fragile glass substrates. Due to the consideration of thinning and cost reduction, they have been gradually replaced by plastic flexible substrates. The manufacture of plastic flexible substrate displays includes a support carrier to be formed on the The plastic flexible substrate on the support carrier and the integrated circuits or various electronic circuits formed on the flexible substrate are then subjected to a peeling procedure to separate the flexible substrate from the support carrier to obtain a plastic flexible substrate display. [0003] There is a known way to separate t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L51/00B32B7/06B32B7/10B32B17/06B32B33/00C08G73/10
CPCC08G73/1067C08G73/1071B32B7/06B32B7/10B32B17/06B32B33/00H10K71/00H10K77/111Y02E10/549Y02P70/50
Inventor 黄彦博蔡宗宪
Owner TAIMIDE TECH
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com