Heat exchange module and electronic device applying heat exchange module

A technology for heat exchange modules and electronic devices, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of unstable heat dissipation core quality, insufficient rigidity, easy bending deformation, etc., and achieve the effect of saving cost and time

Inactive Publication Date: 2016-11-23
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The heat exchange module D2 of the known heat exchange device D is arranged as a heat dissipation core with a casing D7 containing a plurality of heat dissipation aluminum sheets A (such as Figure 1C ), however, the heat dissipation aluminum sheet A must be bent by a machine or stamped by a mold, and then stacked by rotating 180 degrees after applying glue on the L-

Method used

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  • Heat exchange module and electronic device applying heat exchange module
  • Heat exchange module and electronic device applying heat exchange module
  • Heat exchange module and electronic device applying heat exchange module

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Embodiment Construction

[0067] A preferred heat exchange module according to the present invention and an electronic device using the same will be described below with reference to related drawings, wherein the same components will be described with the same reference symbols.

[0068] Figure 2A It is a schematic diagram of the appearance of a heat exchange module in a preferred embodiment of the present invention, Figure 2B for Figure 2A A schematic diagram of the partial appearance of the heat exchange module shown, Figure 2C for Figure 2A Partially exploded schematic diagram of the heat exchange module shown, please also refer to Figure 2A , Figure 2B and Figure 2C As shown, the heat exchange module 1 includes a housing 10, and a plurality of first air guides 11, a plurality of second air guides 12, a plurality of first spacers 13 and a plurality of air guides accommodated in the housing 10. the second spacer 14 . In this embodiment, the casing 10 is a cuboid structure, which has a ...

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Abstract

The invention provides a heat exchange module which comprises a shell, multiple first wind guiding members and multiple first spacing members. The first wind guiding members are arranged in the shell. Each first wind guiding member comprises multiple first structures and multiple second structures. The first structures are arranged in a mutually parallel way. The second structures are arranged among the first structures and connected with the first structures so as to form multiple first channels. The first spacing members are respectively arranged between two adjacent first wind guiding members so as to form second channels. The first channels and the second channels are different in airflow direction. The invention also provides an electronic device applying the heat exchange module.

Description

technical field [0001] The invention relates to a heat exchange module and an electronic device using the same, in particular to a heat exchange module capable of reducing assembly time and cost and an electronic device using the same. Background technique [0002] With the development of the electronic industry, the requirements for the operation speed and effect of the electronic device body are increasing day by day. However, the heat dissipation problem derived from it is becoming more and more serious, which further affects the performance and stability during operation. In order to ensure the normal operation of the electronic device, a heat dissipation device is generally installed on the body of the heat-generating electronic device, and the heat energy is dissipated by the heat dissipation device. [0003] Wherein, the heat cannot be dissipated immediately and effectively only by passive heat dissipation, so the electronic device is usually equipped with a cooling d...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 陈李龙李武奇
Owner DELTA ELECTRONICS INC
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