Heat exchange module and electronic device applying heat exchange module

Abstract

The invention provides a heat exchange module which comprises a shell, multiple first wind guiding members and multiple first spacing members. The first wind guiding members are arranged in the shell. Each first wind guiding member comprises multiple first structures and multiple second structures. The first structures are arranged in a mutually parallel way. The second structures are arranged among the first structures and connected with the first structures so as to form multiple first channels. The first spacing members are respectively arranged between two adjacent first wind guiding members so as to form second channels. The first channels and the second channels are different in airflow direction. The invention also provides an electronic device applying the heat exchange module.

Description

technical field [0001] The invention relates to a heat exchange module and an electronic device using the same, in particular to a heat exchange module capable of reducing assembly time and cost and an electronic device using the same. Background technique [0002] With the development of the electronic industry, the requirements for the operation speed and effect of the electronic device body are increasing day by day. However, the heat dissipation problem derived from it is becoming more and more serious, which further affects the performance and stability during operation. In order to ensure the normal operation of the electronic device, a heat dissipation device is generally installed on the body of the heat-generating electronic device, and the heat energy is dissipated by the heat dissipation device. [0003] Wherein, the heat cannot be dissipated immediately and effectively only by passive heat dissipation, so the electronic device is usually equipped with a cooling d...

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Problems solved by technology

[0004] The heat exchange module D2 of the known heat exchange device D is arranged as a heat dissipation core with a casing D7 containing a plurality of heat dissipation aluminum sheets A (such as Figure 1C ), however, the heat dissipation aluminum sheet A must be bent by a machine or stamped by a mold, and then stacked by rotating 180 degrees after applying glue on the L-shaped edge. The assembly process is more complicated and time-consuming; The thin aluminum sheet used has insufficient rigidity, is easy to bend and deform, and is very easy to cause displacement or inclination in the case when the glue is not dry, which leads to the quality of the heat dissipation core formed by the combination of known thin aluminum sheets. less stable

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