Precision grinding process of high-purity silicon crystal material

Abstract

The invention discloses a precision grinding process of a high-purity silicon crystal material. The precision grinding process includes the steps of S1, preparing grinding slurry, wherein the grinding slurry comprises micro diamond powder, water, grinding aids and active agents and the micro diamond powder, the water, the grinding aids and the active agents are proportioned and prepared according to the mass; S2, setting the grinding rotation speed according to the speed of the rotation axis of a grooving tool 3; S3, carrying out installation, pasting a work-piece to be grooved to a graphite carrier, adjusting the position of a supporting plate of a machine tool, placing the work-piece to be grooved right below the grooving tool and hanging a heavy punch at the end of a lever outside the machine tool; S4, carrying out debugging, starting the machine tool, observing the motion state of a pointer of a dial indicator and repeatedly adjusting the coaxiality of the grooving tool and a rotating shaft of the machine tool; and S5, preparing for grinding, starting the machine tool, closing an outer cover and carrying out grinding on the condition of guaranteeing the grinding feed speed of the work-piece. The precision grinding process has the beneficial effects that the grinding effect is good and the grinding pressure is stable.

Description

technical field [0001] The invention relates to the technical field of precision grinding, in particular to a high-purity silicon crystal material precision grinding process. Background technique [0002] When grinding and grooving high-purity silicon crystal material workpieces, according to their inherent physical and mechanical properties, for workpieces that do not require high precision: generally use vibration-absorbing materials for excessive clamping, and then use electroplated diamond outer round blades to rotate at high speed Grinding and grooving the workpiece. For workpieces with high precision requirements: over-clamping with vibration-absorbing materials, and then using electroplated diamond outer round blades to grind the workpieces, and adding natural diamond micropowder abrasives between the blades and the workpiece. [0003] When the workpiece is ground in the traditional way, the natural diamond micro-abrasive itself removes the excess material of the work...

AI Technical Summary

Problems solved by technology

[0003] When the workpiece is ground in the traditional way, the natural diamond micro-abrasive itself removes the excess material of the workpiece quickly, but the accuracy of the workpiece is difficult to be guaranteed, and there are situations where the abrasive is unevenly distributed in different positions, making the grinding between the workpiece and the abrasive The pressure is not stable enough, which further leads to poor grinding effect, and finally makes the grinding effect unsatisfactory

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