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Short-circuit prevention thermosensitive chip and fabrication method thereof

An anti-short circuit and heat-sensitive technology, which is applied to thermistors, manufacturing resistor chips, circuits, etc., can solve problems such as hindering production and increasing production costs of heat-sensitive chips, so as to reduce the possibility and increase the production of devices cost effect

Active Publication Date: 2016-12-07
DINGSENSE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem of thermal chip short circuit greatly increases the production cost and hinders the progress of production

Method used

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  • Short-circuit prevention thermosensitive chip and fabrication method thereof
  • Short-circuit prevention thermosensitive chip and fabrication method thereof
  • Short-circuit prevention thermosensitive chip and fabrication method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] see Figure 4 and Figure 5 , which are the front view and top view of the structure of the anti-short circuit thermal chip in this embodiment, respectively. The thermosensitive chip comprises a thermosensitive substrate 10, a first metal electrode layer 20 and a second metal electrode layer 30, and the first metal electrode layer 20 and the second metal electrode layer 30 are respectively layered on the thermosensitive substrate 10 on opposite surfaces.

[0030] One surface of the heat-sensitive substrate 10 includes an electrode region (not shown) and an insulating region 12 . The insulating region 12 is disposed around the periphery of the electrode region. The first metal electrode layer 20 is disposed on the surface of the electrode area, and the second metal electrode layer 30 is disposed on the other surface of the thermal chip opposite to the electrode area. Specifically, the size of the first metal electrode layer 20 is smaller than the size of the surface ...

Embodiment 2

[0043] Please also see Figure 8 and Figure 9 , which are the front view and top view of the structure of the anti-short circuit thermal chip in this embodiment, respectively. The thermosensitive chip comprises a thermosensitive substrate 10, a first metal electrode layer 20 and a second metal electrode layer 30, and the first metal electrode layer 20 and the second metal electrode layer 30 are respectively layered on the thermosensitive substrate 10 on opposite surfaces.

[0044]Both surfaces of the heat-sensitive substrate 10 include electrode regions (not shown) and insulating regions 12 . The insulating region 12 is disposed around the periphery of the electrode region. The first metal electrode layer 20 and the second metal electrode layer 30 are respectively layered on the surfaces of the two electrode regions. Specifically, the size of the first metal electrode layer 20 is smaller than the size of the surface of the thermosensitive substrate, and the first metal el...

Embodiment 3

[0058] Taking a thermosensitive chip with a resistance value R=10KΩ±5% at 25°C as an example, a preparation method thereof is as follows.

[0059] S1: Preparation of heat-sensitive substrate: prepare 10KΩ heat-sensitive substrate powder, sinter the powder at high temperature to form an ingot; then cut the ingot into pieces.

[0060] S2: Print metal paste on both sides of the heat-sensitive substrate and sinter it to form electrodes, and form horizontal and vertical grooves staggered on the electrodes on one side of the heat-sensitive substrate. Specifically, silver electrodes are first printed on one side of the heat-sensitive substrate and dried. Then, grid-shaped silver electrodes are printed on the other side of the heat-sensitive substrate and dried. High-temperature sintering makes the electrode and heat-sensitive substrate combined. Then put it into a constant temperature oil bath at 25°C for resistance testing and cleaning.

[0061] S3: According to the resistivity f...

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Abstract

The invention discloses a short-circuit prevention thermosensitive chip and a fabrication method thereof. The thermosensitive chip comprises a thermosensitive substrate, a first metal electrode layer and a second metal electrode layer, wherein a surface of the thermosensitive substrate comprises an electrode region and an insulation region, the insulation region is arranged at the periphery of the electrode region in an encircling way, the first metal electrode layer is arranged on a surface of the electrode region in a layered way, and the second metal electrode layer is arranged the other surface, opposite to the electrode region, of the thermosensitive substrate in a layered way. Compared with the prior art, the short-circuit prevention thermosensitive chip disclosed by the invention has the advantages that the insulation region is formed on the surface of the thermosensitive substrate, and thus, the probability of device short circuit is substantially reduced on the premise of no increase of device fabrication cost.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a short-circuit-proof heat-sensitive chip and a preparation method thereof. Background technique [0002] With the continuous and rapid development of electronic equipment in the direction of intelligence, thermal chips are more and more widely used as temperature measurement, compensation, and surge current suppression. In the prior art, the manufacturing material of the thermosensitive chip is usually ceramics or polymers. The production process is generally: powder preparation → sintering spindle → slicing → printing precious metal electrodes → sintering silver sheet → edge selection → cutting. see figure 1 , which is a schematic structural diagram of a thermosensitive chip prepared in the prior art. The heat-sensitive chip includes a metal electrode 1 and a porcelain body 2 , the metal electrode 1 is layered on both surfaces of the porcelain body 2 , and the ...

Claims

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Application Information

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IPC IPC(8): H01C7/00H01C17/00
CPCH01C7/008H01C17/006
Inventor 贺晓东段兆祥杨俊唐黎民
Owner DINGSENSE ELECTRONICS TECH CO LTD
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