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Coated solder material and method for producing same

A manufacturing method and solder technology, used in welding/cutting media/materials, manufacturing tools, metal material coating processes, etc., can solve problems such as uneven activation, and achieve excellent wet expansion and efficient manufacturing.

Inactive Publication Date: 2016-12-07
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the techniques described in these documents, since the plasmaization of the reaction gas and the activation of the atomized spray coating forming material are performed simultaneously, the activation of the spray coating forming material becomes uneven, and it is difficult to spray the material on the surface of the substrate. Form a dense coating film on the entire surface without omission
In addition, none of the techniques described in these documents is intended to prevent the oxidation of the surface of the solder material. Regarding the state of the coating film when the solder material is molten, the influence of the presence of the coating film on wet spreadability, bondability, and Issues such as the generation of gaps have not been considered

Method used

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  • Coated solder material and method for producing same
  • Coated solder material and method for producing same
  • Coated solder material and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～110、 comparative example 1～13

[0174] As Examples 1 to 110 and Comparative Examples 1 to 13, an atmospheric pressure plasma polymerization treatment device (plasma polymer lab system (plasma polymer lab system, plasma polymer lab system, plasma polymer lab system) PAD-1 type, Plasmatreat (Plasmatreat Co., Ltd)) samples in which coating films were formed on the surfaces of solder materials 1 to 35 under the conditions shown in Table 2. It should be noted that, in these examples and comparative examples, use N 2 As a carrier gas, the introduction amount of the coating material was adjusted to 20 g / hour, and the plasmaization conditions were set as follows.

[0175] The emission frequency of the plasma generator: 21kHz

[0176] Generator output voltage: 280V

[0177] Pressure: atmospheric pressure (1013.25hPa)

[0178] The thickness of the coating film of the obtained coating solder material and its maximum value and minimum value can be determined by adjusting the coating solder material to a state where c...

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Abstract

The present invention provides a coated solder material, with which the progression of oxidation of a surface can be prevented during long-term storage and during melting, which has superior wet spreading and bondability, and with which no gaps will occur at bonding sections, as well as a method for producing the same. This coated solder material is characterized in that: a coated film has been formed on the surface of a solder material; the thickness is 4 to 200 nm; and the mass reduction rate in a case of being heated at 150 DEG C to 300 DEG C and melted is 60% or higher; the coated film is composed of a carbon compound formed by introducing a C8 or lower organic compound along with a carrier gas into a reaction gas that has been converted into plasma under atmospheric pressure, radicalizing the organic compound to form a radical organic compound, and thereafter having the radical organic compound react to a metal of the surface of the solder material.

Description

technical field [0001] The present invention relates to a solder material used in the manufacture of a semiconductor device, and more particularly to a surface-treated clad solder material using a coating film and a manufacturing method thereof. Background technique [0002] In the manufacture of semiconductor element bonding boards, semiconductor devices, and the like, soldering is generally used when bonding metal materials to each other or when bonding electronic components such as semiconductor elements to a printed circuit board. The solder material used in soldering is molded into various shapes such as wire, ribbon, sheet, preformed material (punched material), ball, and fine powder. [0003] The solder material is easily oxidized in the presence of oxygen, and an oxide film is formed on the surface during storage. In particular, when the solder material is used after a long period of time after production, oxidation progresses and the oxide film becomes thicker, whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/14B23K35/363B23K35/40C23C16/30
CPCB23K35/40C23C16/26C23C16/50B23K35/26B23K35/262B23K35/264B23K35/28B23K35/282B23K35/38B23K35/383B23K35/404B23K35/02B23K35/0222B23K35/0227B23K35/0244B23K35/3613B23K35/0233B23K35/268B23K35/3013B23K35/3612
Inventor 小林宏山边秀敏宫内恭子
Owner SUMITOMO METAL MINING CO LTD
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