Optoelectronic module for contactless optical link, related multi-channel modules, interconnection system, and associated method for manufacturing and connecting to a card

Abstract

The invention relates to an optoelectronic module (M) for converting an electrical signal from an electronic card into an optical signal or vice versa, comprising the following stack: an electronic card (1) for serving Interface with an application electronic card; An electronic control component adapted to carry out the control of an optoelectronic component, the electronic component being fixed directly on the electronic card and electrically connected to the electronic circuit; an optoelectronic component (3) adapted to emit or receive a light signal via its upper surface, the optoelectronic component being fixed directly on top of the electronic component and electrically connected to the electronic component; An optical device (9) adapted to transmit an optical signal; An optical device support (10), the support being fixed directly to the electronic card so as to ensure the mechanical alignment between the optical device and the optoelectronic component.

Description

technical field [0001] The present invention relates to optoelectronic modules for contactless free-space optical links, usually intended to be soldered to electronic boards, also called printed The circuit is also referred to as an application board and is intended for converting electrical signals into optical signals or converting optical signals into electrical signals. [0002] The invention relates to a transmitter module and a receiver module and an interconnection system comprising at least one device having a transmitter module and at least one device having a receiver module adapted to be optically coupled to the transmitter module, intended for The electrical signal is converted into an optical signal by the transmitter module and the optical signal transmitted by the transmitter module and received by the receiver module is converted into an electrical signal by the receiver module. [0003] The main application targeted by the invention is a link between two elec...

AI Technical Summary

Problems solved by technology

[0013] However, all known fiber optic optoelectronic modules (such as in Fiber Optic Modules presented in the range) exhibit a much larger footprint due to the implementation of the connections required to splice with the fiber or due to the direct use of the fiber within a TOSA or ROSA

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