Optoelectronic module for contactless optical link, related multi-channel modules, interconnection system, and associated method for manufacturing and connecting to a card

一种光电模块、多通道的技术，应用在印刷电路制造、电磁波传输系统、提供连接器和印刷电路板等方向，能够解决多占用空间等问题，达到减小占用空间、减小模块尺寸的效果

Active Publication Date: 2016-12-14
RADIALL SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] However, all known fiber optic optoelectronic modules (such as in Fiber Optic Modules presented in the range) exhibit a much larger footprint due to the implementation of the connections required to splice with the fiber or due to the direct use of the fiber within a TOSA or ROSA

Method used

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  • Optoelectronic module for contactless optical link, related multi-channel modules, interconnection system, and associated method for manufacturing and connecting to a card
  • Optoelectronic module for contactless optical link, related multi-channel modules, interconnection system, and associated method for manufacturing and connecting to a card
  • Optoelectronic module for contactless optical link, related multi-channel modules, interconnection system, and associated method for manufacturing and connecting to a card

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Embodiment Construction

[0091] Throughout this application, the terms "vertical", "lower", "higher", "bottom", "top", "under" are understood with reference to the stacking direction of the individual components of the photovoltaic module according to the invention ,"above".

[0092] exist figure 1 A photovoltaic module M according to the invention is shown in .

[0093] The individual elements of the module M are stacked on top of each other and attached to each other, preferably by gluing, for example by means of epoxy glue, or by soldering.

[0094] Thus, from bottom to top of the stack, module M consists of:

[0095] - a printed circuit 1 which will act as an interface with the electronic application board;

[0096] - an electronic control part 2 attached directly to the printed circuit 1 and electrically connected to the electronic circuit by wires 4 soldered according to "wire-bonding" or bridging techniques;

[0097] - an optoelectronic component 3, adapted to transmit or receive light sign...

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Abstract

The invention relates to an optoelectronic module (M) for converting an electrical signal from an electronic card into an optical signal or vice versa, comprising the following stack: an electronic card (1) for serving Interface with an application electronic card; An electronic control component adapted to carry out the control of an optoelectronic component, the electronic component being fixed directly on the electronic card and electrically connected to the electronic circuit; an optoelectronic component (3) adapted to emit or receive a light signal via its upper surface, the optoelectronic component being fixed directly on top of the electronic component and electrically connected to the electronic component; An optical device (9) adapted to transmit an optical signal; An optical device support (10), the support being fixed directly to the electronic card so as to ensure the mechanical alignment between the optical device and the optoelectronic component.

Description

technical field [0001] The present invention relates to optoelectronic modules for contactless free-space optical links, usually intended to be soldered to electronic boards, also called printed The circuit is also referred to as an application board and is intended for converting electrical signals into optical signals or converting optical signals into electrical signals. [0002] The invention relates to a transmitter module and a receiver module and an interconnection system comprising at least one device having a transmitter module and at least one device having a receiver module adapted to be optically coupled to the transmitter module, intended for The electrical signal is converted into an optical signal by the transmitter module and the optical signal transmitted by the transmitter module and received by the receiver module is converted into an electrical signal by the receiver module. [0003] The main application targeted by the invention is a link between two elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42G02B6/43
CPCG02B6/4228G02B6/4237G02B6/4239G02B6/43G02B6/4206G02B7/027H01L31/0203H01L33/486H01L33/58H01S5/02212H04B10/803H01L2224/48091H01L2224/48472H01L2224/73265H01L2924/19107H01L31/02325H01L25/0756H01S5/183G02B6/428H01S5/02253H01L2924/00014G02B6/4224H01S5/02345G01J1/0403G01J1/0411G01J1/44H01L31/105H05K1/0266H05K1/0274H05K1/181H05K3/303H05K5/0026H05K2201/10121H05K2203/167
Inventor 文森特·夫卡尔克里斯汀·克拉乌德皮埃尔马赛厄斯·佩兹劳伦斯·皮若尔弗朗索瓦·奎恩特尔
Owner RADIALL SA
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