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Flexible substrate manufacturing method and flexible substrate

A technology of flexible substrates and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of high production cost and high process complexity, reduce production cost, simplify process flow, and avoid warping The effect of music

Active Publication Date: 2018-08-14
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, an embodiment of the present invention provides a flexible substrate manufacturing method and a flexible substrate, which solve the problems of high process complexity and high production cost in order to prevent the substrate from warping during baking in the existing flexible substrate manufacturing method

Method used

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  • Flexible substrate manufacturing method and flexible substrate
  • Flexible substrate manufacturing method and flexible substrate
  • Flexible substrate manufacturing method and flexible substrate

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0034] figure 1 Shown is a schematic flow chart of a method for manufacturing a flexible substrate provided by an embodiment of the present invention. Such as figure 1 As shown, the flexible substrate manufacturing method includes:

[0035] Step 101: if figure 2 As shown, at least one groove 2 is formed on the surface of a rigid substrate 1 .

[0036] The size of the at least one groove 2 should correspond to the size of the display screen body t...

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Abstract

Embodiments of the present invention provide a flexible substrate manufacturing method and a flexible substrate, which solve the problems of high process complexity and high production cost in the existing flexible substrate manufacturing method. The manufacturing method of the flexible substrate includes: forming at least one groove on the surface of a rigid substrate; coating a flexible substrate material on the surface of the rigid substrate, and the flexible substrate material covers the at least one groove; The substrate material is baked.

Description

technical field [0001] The invention relates to the technical field of display preparation, in particular to a method for manufacturing a flexible substrate and the flexible substrate. Background technique [0002] In a flexible liquid crystal display or a flexible OLED (Organic Light Emitting Display) display, thin film transistors (TFTs) are prepared on a flexible substrate. The preparation process of the flexible substrate is generally: the flexible substrate material (such as polyimide) is coated on a rigid substrate (such as a glass substrate), and then the flexible substrate material is heated and baked to cure Form a flexible substrate. However, since the thermal expansion coefficient of the flexible substrate material is different from that of the rigid substrate, the thermal stress will cause warpage around the rigid substrate. [0003] In order to solve the above problems, there are two solutions in the prior art. One is to use jigs to fix the rigid substrate wh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/80H10K71/00
Inventor 贺良伟郭瑞
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD