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Millimeter wave multichannel receiving-transmitting circuit module and power division network high density integrated circuit

A technology of transceiver circuits and power division networks, which is applied in the field of high-density integration of multi-channel transceiver circuit modules and power division networks in the millimeter wave frequency band, can solve the problem of increasing circuit complexity and system loss, and is not conducive to system miniaturization, light weight and integration. To achieve the effect of miniaturization, light weight and compact wiring

Active Publication Date: 2016-12-14
10TH RES INST OF CETC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This connection method not only increases the complexity of the circuit and system loss, but also has a large vertical dimension, which is not conducive to the miniaturization, light weight and integrated design of the system

Method used

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  • Millimeter wave multichannel receiving-transmitting circuit module and power division network high density integrated circuit
  • Millimeter wave multichannel receiving-transmitting circuit module and power division network high density integrated circuit
  • Millimeter wave multichannel receiving-transmitting circuit module and power division network high density integrated circuit

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Embodiment Construction

[0020] refer to Figure 1-Figure 3 . figure 1 , figure 2 and image 3A best implementation example of the millimeter-wave multi-channel transceiver circuit module and power division network high-density integrated circuit design of the present invention is described. In a preferred implementation example, the millimeter-wave multi-channel transceiver circuit module and the power division network high-density integrated circuit include: a dielectric substrate 3 prepared by using a microwave printed board, and a multi-channel transceiver circuit module 1 arranged on the dielectric substrate 3 , the power distribution network 2, and the low-frequency control and power interface 8 distributed on the periphery of the dielectric substrate 3, wherein the multi-channel transceiver circuit module 1 includes a rectangular mounting interface 12 provided with a phase shifter chip circuit and a rectangular mounting The amplifier chip mounting interface 11 on both sides of the interface...

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PUM

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Abstract

The invention discloses a millimeter wave multichannel receiving-transmitting circuit module and power division network high density integrated circuit, and provides the high density integrated circuit with compact routing, low frequency control, and a power supply which does not take up spaces of chip and network layers. According to a technical scheme disclosed by the invention: a chip attachment interface of the multichannel receiving-transmitting circuit module, and a power division network are positioned on a same layer; one-to-two power dividers are adopted to carry out rectangle arraying on mirror symmetrical two-channel receiving-transmitting circuit modules, wherein the attachment interfaces of an amplifier chip and a phase shifter chip are integrated with the power division network to a same medium layer, thereby finishing transmission of radio frequency signals; a radio frequency port and a low frequency port are connected to an antenna unit and a wave controller via an elastic touch manner; and low frequency control pins of the amplifier chip and the phase shifter chip located on the attachment interfaces, and the pins of the power supply are connected with corresponding low frequency control pads (4) and power supply pads (5) on a medium substrate via a gold wire bonding manner, and are arranged around the medium substrate.

Description

technical field [0001] The invention relates to a high-density integration technology of millimeter wave frequency band multi-channel transceiver circuit module and power division network that can be used in multiple technical fields such as radar, data link communication, and satellite communication. The technology is suitable for millimeter wave two-dimensional phased array antennas system. Background technique [0002] The increasing crowding of modern microwave spectrum resources, as well as the limitations of optical and infrared systems in penetrating smoke, clouds and other harsh environments and working at night, have prompted people to study millimeter-wave frequency bands. With the development of wireless communication technology, low-frequency bands The frequency spectrum has become more and more crowded, and the demand for high-quality and large-capacity wireless communication equipment has made the communication frequency continuously increase. Due to its short ...

Claims

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Application Information

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IPC IPC(8): H04B1/40
CPCH04B1/40
Inventor 魏旭蓝海何海丹
Owner 10TH RES INST OF CETC
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