A vertical reflow furnace

Abstract

The embodiment of the invention discloses a vertical reflow furnace. The phenomena of retention and plate clamping generated when PCBs go in and out of a vertical conveying channel at the connection position can be effectively avoided, and product connection is smoother. The vertical reflow furnace comprises an outlet and inlet connection mechanism. The outlet and inlet connection mechanism comprises an inlet connection board feeding assembly, an outlet connection board discharging assembly, board assemblies, a first optic eye assembly and a second optic eye assembly. The inlet connection board feeding assembly is connected with the bottom of the inlet end of the vertical reflow furnace, and the outlet connection board discharging assembly is connected with the bottom of the outlet end of the vertical reflow furnace. The inlet connection board feeding assembly and the outlet connection board discharging assembly are provided with the board assemblies correspondingly, and the board assemblies are used for achieving a stop function or a pushing function on the PCBs. The inlet connection board feeding assembly is provided with the first optic eye assembly, and the first optic eye assembly is used for generating a first induction signal to the PCBs at the inlet end of the vertical reflow furnace. The outlet connection board discharging assembly is provided with the second optic eye assembly, and the second optic eye assembly is used for generating a second induction signal to the PCBs at the outlet end of the vertical reflow furnace.

Description

technical field [0001] The invention relates to the field of electronic product processing equipment, in particular to a vertical reflow furnace. Background technique [0002] Electronic circuit surface mount technology (Surface Mount Technology, SMT) is a surface mount component (Surface Mounted component, SMC) or surface mount device (Surface Mounted Devices, SMD) without pins or short leads mounted on a printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates, by reflow soldering or dip soldering and other methods to solder and assemble the circuit assembly technology. Its main technological process may include: printing, chip placement, welding, and maintenance, among which, the welding process mainly uses reflow soldering equipment for welding. [0003] The connecting table is a kind of transport equipment for the intermediate transition of transporting PCB boards from one processing equipment to another processing equipment. Its main funct...

AI Technical Summary

Problems solved by technology

The existing connection mechanism is an external connection table. When the PCB board needs to be sent into the vertical reflow furnace, the connection table has a motor drive action to actively transport it, but there is no connection between the connection table and the reflow soldering equipment. The transmission mechanism mainly uses the friction force between the PCB board and the upper computer transportation chain, the friction force of the reflow welding transportation chain, and the inertia of the PCB board, so that the PCB board is transported from the upper computer transportation chain to the transportation chain of the reflow welding equipment. However, this This method of passively relying on friction and inertial transportation may easily cause PCB boards to be not transported in place, and even PCB boards may be stuck or dropped, making the entire production unsmooth and reducing production efficiency

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