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Substrate separation apparatus for stacked body

一种剥离设备、衬底的技术，应用在层压、分层产品、电固体器件等方向，能够解决不能玻璃衬底施加微细等问题，达到防止解除吸附、可靠剥离的效果

Inactive Publication Date: 2016-12-21
SEMICON ENERGY LAB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the method disclosed in Patent Document 2 cannot apply fine and adjusted force to the glass substrate to be separated.

Method used

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  • Substrate separation apparatus for stacked body
  • Substrate separation apparatus for stacked body
  • Substrate separation apparatus for stacked body

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Embodiment approach 1

[0027] Embodiment 1 of the present invention will be described below with reference to the drawings. figure 1 It is an overall perspective view showing the substrate peeling equipment of the laminated body according to Embodiment 1 of the present invention. The substrate peeling equipment 1 according to Embodiment 1 includes a fixing table (fixing tool) 3 for fixing the laminated body 2 , a first adsorber 4 , a second adsorber 5 , and a wedge tool (peeling start unit) 6 . Note that in figure 1 The details of the power mechanism and the like included in each component are not shown in the figure.

[0028] The laminated body 2 corresponds to the thin element layer 23 sandwiched by the first substrate 21 and the second substrate 22 (refer to Figure 6 , Figure 7 as well as Figure 9 ) components. For example, although the first substrate 21 and the second substrate 22 are not particularly limited, hard substrates such as glass substrates may be used. For example, as the el...

Embodiment approach 2

[0041] Figure 11 The substrate peeling equipment of the laminated body of Embodiment 2 of this invention is shown. Such as Figure 11 As shown, the substrate peeling apparatus 11 of Embodiment 2 is in addition to the substrate peeling apparatus 1 of Embodiment 1 described above (refer to Figure 5 ) has four first adsorption portions 411 , 412 , 413 , and 414 arranged at the central portion of the second substrate 22 in addition to the constituent elements. That is, in the substrate peeling apparatus 1 of Embodiment 1 described above, the first suction portion 41 and the second suction portion 51 are disposed only on the edge of the second substrate 22 . However, in the substrate peeling apparatus 11 according to Embodiment 2, four first suction parts 411 , 412 , 413 , and 414 are additionally arranged on the central portion of the second substrate 22 .

[0042] By adopting the above structure, the first adsorption portion can be arranged on the entire surface of the secon...

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Abstract

A wedge-shaped jig (6) is inserted into a gap between a first substrate (21) and a second substrate (22) at a corner (221) of the second substrate (22) and separation of the attached first substrate (21) and second substrate (22) starts to proceed; then, a second suction pad (53) of a second suction portion (51), which is the closest to the corner (221), moves upward. Then, first suction pads (43) of first suction portions (41a), (41b), and (41c) sequentially move upward such that one side of the second substrate (22) separates from the stacked body. Although the second substrate (22) warps as the separation of the second substrate (22) proceeds, each of the plurality of first suction pads (43) elastically deforms. Therefore, the first suction pads (43) can be prevented from being detached from the second substrate (22), and the substrate (22) can be securely separated from the stacked body.

Description

technical field [0001] The present invention relates to a substrate peeling device for a laminated body. More specifically, the present invention relates to a method for peeling off a laminate in which element layers including a light emitting element, a power generating element, an electricity storage element, a display element, a memory element, or a semiconductor element are formed between a pair of substrates. A substrate lift-off apparatus for a laminate of substrates. Background technique [0002] In recent years, the research and development of light-emitting elements using electroluminescence (EL) has become increasingly active. The basic structure of these light-emitting elements is a structure in which a layer containing a light-emitting substance is sandwiched between a pair of electrodes. By applying a voltage to the light-emitting element, the light-emitting substance can be made to emit light. The use of a flexible substrate (also referred to as a flexible s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L27/12H01L51/50H05B33/02H05B33/10H05B33/14
CPCH01L21/67092H01L21/6838Y10T156/1944Y10T156/1967Y10T156/1961Y10T156/1978Y10T156/1132Y10T156/1184Y10T156/1168Y10T156/1928H01L21/463H01L21/67712H01L21/78B32B38/10B32B43/006
Inventor 大野正胜井户尻悟菊地宽平平形吉晴横山浩平
Owner SEMICON ENERGY LAB CO LTD
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