No-clean high-temperature electronic soldering flux and preparation method thereof

Abstract

The invention discloses a no-clean high-temperature electronic soldering flux and a preparation method thereof. The electronic soldering flux comprises the following raw materials: bismuth chloride, tin fluosilicate, tin methanesulfonate, titanium dioxide, glass fiber reinforced plastics powder, zirconium acetylacetone, 1-benzyl hydantoin, polyethylene glycol oleate, organic bentonite, dicyl polyglycoside, poly (3, 4-ethylenedioxythiophene)- polystyrolsulfon acid, trisruthenium chloride, diethylene glycol monohexyl ether, dipropylene glycol monomethyl ether, pamite, N-N-dimethylacetamide, disproportionate rosin potassium, methyl diethanolamine, lauroyl diethanolamine, 1-N- hydroxybenzotriazole and barium dinonylnaphthalenesulfonate. In a brazing process, the soldering flux prepared by the preparation method disclosed by the invention releases little chemical salt fog, and is full in welding points, free of corrosion and retraction phenomenon, high in wetting force, large in shear strength, excellent in welding assistance performance, free of residual welding points after brazing, bright in surface, clean enough to require no subsequent cleaning procedure, and convenient to use.

Description

technical field

[0001] The invention belongs to the technical field of electronic materials, and in particular relates to a no-cleaning high-temperature electronic flux and a preparation method thereof. Background technique

[0002] Flux is an important part of electronic connection materials. In the electronic packaging process, flux mainly plays the role of "helping welding". The performance of flux plays a key role in achieving a good brazing connection. Therefore, more and more companies pay attention to the selection and application of flux.

[0003] For flux, it is required to have good flux, high insulation and low corrosion. At present, although there are many types of flux, the use of some fluxes will cause the solder joints to be dirty and difficult to clean. At the same time, the residual flux will corrode the solder joints more or less, affecting the connection strength of the solder joints, thus Greatly reduce the quality and reliability of electronic products...

Examples

Embodiment 1

[0025] A no-cleaning high-temperature electronic flux, comprising the following raw materials in parts by weight: 5 parts of bismuth chloride, 3 parts of tin fluorosilicate, 2 parts of tin methanesulfonate, 1 part of titanium dioxide, 1 part of glass fiber reinforced plastic powder, zirconium acetylacetonate 2.4 parts, 6 parts of 1-benzylhydantoin, 3 parts of polyethylene glycol oleate, 2 parts of organic bentonite, 4 parts of decyl glucoside, poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate 3 parts of acid, 2 parts of triphenylphosphine ruthenium chloride, 18 parts of diethylene glycol monohexyl ether, 16 parts of dipropylene glycol monomethyl ether, 4 parts of tall oil rosin, 2 parts of N, N-dimethylacetamide 1 part, 1 part of disproportionated potassium abietate, 1 part of methyl monoethanolamine, 2 parts of lauroyl diethanolamine, 3 parts of 1-N-hydroxybenzotriazole, 2 parts of barium dinonylnaphthalenesulfonate.

[0026] The preparation method of the no-cleaning high...

Embodiment 2

[0034] A no-cleaning high-temperature electronic flux, comprising the following raw materials in parts by weight: 11 parts of bismuth chloride, 9 parts of tin fluorosilicate, 6 parts of tin methanesulfonate, 7 parts of titanium dioxide, 4 parts of glass fiber reinforced plastic powder, zirconium acetylacetonate 6 parts, 10 parts of 1-benzylhydantoin, 9 parts of polyethylene glycol oleate, 6 parts of organic bentonite, 9 parts of decyl glucoside, poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate 7 parts of acid, 6 parts of triphenylphosphine ruthenium chloride, 28 parts of diethylene glycol monohexyl ether, 25 parts of dipropylene glycol monomethyl ether, 9 parts of tall oil rosin, 8 parts of N, N-dimethylacetamide 5 parts, 5 parts of disproportionated potassium abietate, 4 parts of methyl monoethanolamine, 5 parts of lauroyl diethanolamine, 8 parts of 1-N-hydroxybenzotriazole, 7 parts of barium dinonylnaphthalenesulfonate.

[0035] The preparation method of the no-cleaning...

Embodiment 3

[0043]A no-cleaning high-temperature electronic flux, comprising the following raw materials in parts by weight: 5.6 parts of bismuth chloride, 3.2 parts of tin fluorosilicate, 2.8 parts of tin methanesulfonate, 1.5 parts of titanium dioxide, 1.4 parts of glass fiber reinforced plastic powder, zirconium acetylacetonate 2.8 parts, 6.5 parts of 1-benzylhydantoin, 3.5 parts of polyethylene glycol oleate, 2.5 parts of organic bentonite, 4.2 parts of decyl glucoside, poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate 3.5 parts of acid, 2.4 parts of triphenylphosphine ruthenium chloride, 20 parts of diethylene glycol monohexyl ether, 18 parts of dipropylene glycol monomethyl ether, 4.5 parts of tall oil rosin, 2.4 parts of N, N-dimethylacetamide 1.4 parts of disproportionated potassium abietate, 1.6 parts of methyl monoethanolamine, 2.7 parts of lauroyl diethanolamine, 3.6 parts of 1-N-hydroxybenzotriazole, and 2.6 parts of barium dinonylnaphthalenesulfonate.

[0044] The prepara...

technical field

[0001] The invention belongs to the technical field of electronic materials, and in particular relates to a no-cleaning high-temperature electronic flux and a preparation method thereof. Background technique

[0002] Flux is an important part of electronic connection materials. In the electronic packaging process, flux mainly plays the role of "helping welding". The performance of flux plays a key role in achieving a good brazing connection. Therefore, more and more companies pay attention to the selection and application of flux.

[0003] For flux, it is required to have good flux, high insulation and low corrosion. At present, although there are many types of flux, the use of some fluxes will cause the solder joints to be dirty and difficult to clean. At the same time, the residual flux will corrode the solder joints more or less, affecting the connection strength of the solder joints, thus Greatly reduce the quality and reliability of electronic products...

Examples

Embodiment 1

[0025] A no-cleaning high-temperature electronic flux, comprising the following raw materials in parts by weight: 5 parts of bismuth chloride, 3 parts of tin fluorosilicate, 2 parts of tin methanesulfonate, 1 part of titanium dioxide, 1 part of glass fiber reinforced plastic powder, zirconium acetylacetonate 2.4 parts, 6 parts of 1-benzylhydantoin, 3 parts of polyethylene glycol oleate, 2 parts of organic bentonite, 4 parts of decyl glucoside, poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate 3 parts of acid, 2 parts of triphenylphosphine ruthenium chloride, 18 parts of diethylene glycol monohexyl ether, 16 parts of dipropylene glycol monomethyl ether, 4 parts of tall oil rosin, 2 parts of N, N-dimethylacetamide 1 part, 1 part of disproportionated potassium abietate, 1 part of methyl monoethanolamine, 2 parts of lauroyl diethanolamine, 3 parts of 1-N-hydroxybenzotriazole, 2 parts of barium dinonylnaphthalenesulfonate.

[0026] The preparation method of the no-cleaning high...

Embodiment 2

[0034] A no-cleaning high-temperature electronic flux, comprising the following raw materials in parts by weight: 11 parts of bismuth chloride, 9 parts of tin fluorosilicate, 6 parts of tin methanesulfonate, 7 parts of titanium dioxide, 4 parts of glass fiber reinforced plastic powder, zirconium acetylacetonate 6 parts, 10 parts of 1-benzylhydantoin, 9 parts of polyethylene glycol oleate, 6 parts of organic bentonite, 9 parts of decyl glucoside, poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate 7 parts of acid, 6 parts of triphenylphosphine ruthenium chloride, 28 parts of diethylene glycol monohexyl ether, 25 parts of dipropylene glycol monomethyl ether, 9 parts of tall oil rosin, 8 parts of N, N-dimethylacetamide 5 parts, 5 parts of disproportionated potassium abietate, 4 parts of methyl monoethanolamine, 5 parts of lauroyl diethanolamine, 8 parts of 1-N-hydroxybenzotriazole, 7 parts of barium dinonylnaphthalenesulfonate.

[0035] The preparation method of the no-cleaning...

Embodiment 3

[0043]A no-cleaning high-temperature electronic flux, comprising the following raw materials in parts by weight: 5.6 parts of bismuth chloride, 3.2 parts of tin fluorosilicate, 2.8 parts of tin methanesulfonate, 1.5 parts of titanium dioxide, 1.4 parts of glass fiber reinforced plastic powder, zirconium acetylacetonate 2.8 parts, 6.5 parts of 1-benzylhydantoin, 3.5 parts of polyethylene glycol oleate, 2.5 parts of organic bentonite, 4.2 parts of decyl glucoside, poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate 3.5 parts of acid, 2.4 parts of triphenylphosphine ruthenium chloride, 20 parts of diethylene glycol monohexyl ether, 18 parts of dipropylene glycol monomethyl ether, 4.5 parts of tall oil rosin, 2.4 parts of N, N-dimethylacetamide 1.4 parts of disproportionated potassium abietate, 1.6 parts of methyl monoethanolamine, 2.7 parts of lauroyl diethanolamine, 3.6 parts of 1-N-hydroxybenzotriazole, and 2.6 parts of barium dinonylnaphthalenesulfonate.

[0044] The prepara...