Technology for flattening and encapsulating sensor
A sensor and sensor chip technology, applied in the field of fingerprint sensor packaging process improvement, to achieve the effect of improving product reliability and product yield
Active Publication Date: 2017-01-04
SHENZHEN CHIPSAILING TECH CO LTD
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Problems solved by technology
[0007] To sum up, the purpose of the present invention is to solve the technical deficiencies in the removal of wafer marks in existing FPS packaging products, and propose a process for flat packaging sensors
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[0016] The process of the present invention will be further described below in conjunction with the accompanying drawings and preferred specific embodiments of the present invention.
[0017] refer to figure 2 As shown in, the present invention also adopts epoxy molding compound to package the sensor chip, the difference is that the content of the filler in the epoxy molding compound and the specific components of the filler are different, and the epoxy molding compound of the present invention contains filler And curing agent (phenolic resin), filler and phenolic resin accounted for 60-90% and 7-18% of the weight of the whole epoxy molding compound respectively; while the main components of the filler are alumina and SiO 2 , the weight percentages of alumina in the filler are: 30% to 45%, SiO 2 The percentage by weight of the filler is: 55% to 70%; the present invention mainly improves the proportion of the filler, and at the same time controls the glass transition temperat...
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The invention provides a technology for flattening and encapsulating a sensor, relates to the technical field of sensor encapsulating technologies, and aims at overcoming the technical defects existing in wafer mark removing of an existing FPS encapsulating product. A sensor chip is encapsulated by adopting an epoxy molding compound, wherein the epoxy molding compound is prepared from a filling agent and phenolic resin, and the filling agent is mainly prepared from, by weight, 30%-45% of aluminum oxide and 55%-70% of SiO2. The technology has the advantages that the proportion of the filling agent is improved, and meanwhile the glass transition temperature is controlled at 140+ / -10 DEG C by changing the content of a curing agent, so that the shrinkage rate of the epoxy molding compound is decreased to 0.16; accordingly, the technical problem that wafer marks influencing the surface flatness of the sensor are formed in curing of the epoxy molding compound is effectively solved, the cost is reduced, the heat dissipation performance is improved, polishing is not needed, the product yield is greatly increased, and the product reliability is improved.
Description
technical field [0001] The invention relates to the technical field of sensor packaging technology, in particular to the improvement of the fingerprint sensor packaging technology. Background technique [0002] Nowadays, sensor packaging has higher and higher requirements for the flatness of the package surface, especially for FPS (fingerprint sensor fingerprint sensor) packaging products, because of its appearance, the key surface must increase peripheral entities; and in the process of forming peripheral entities on the surface of sensor chips , due to the large shrinkage rate of the plastic sealing compound used, in the plastic sealing process, the commonly used plastic sealing compound is cooled from gel to solid state at high temperature, and the cumulative shrinkage in the longitudinal direction is different due to the different depth of the plastic sealing compound. Deeper The area of the area is larger than the shrinkage of the shallower area, referring to figure ...
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IPC IPC(8): C08L63/00C08L61/06C08K13/02C08K3/22C08K3/36
CPCC08L63/00C08L2203/206C08L61/06C08K13/02C08K2003/2227C08K3/36
Inventor 于泽
Owner SHENZHEN CHIPSAILING TECH CO LTD