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Fingerprint cover plate module and manufacturing method thereof

A production method and cover technology, which is applied in character and pattern recognition, instruments, computer parts, etc., can solve the problems of restricted fingerprint cover module size, poor user fingerprint recognition experience, and poor matching of mobile phones, etc., to achieve richness Color selection space, accurate fingerprint recognition operation, and improved matching effect

Pending Publication Date: 2017-01-04
苏州科阳半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on the above, an object of the present invention is to propose a fingerprint cover module to solve the problems of the existing fingerprint cover module with small area, low strength, single color and poor compatibility with mobile phones
[0004] Another purpose of the present invention is to propose a manufacturing method suitable for the above-mentioned fingerprint cover module, so as to solve the problem that the size of the existing fingerprint cover module is limited by the size of the chip, and the user's fingerprint recognition experience is poor

Method used

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  • Fingerprint cover plate module and manufacturing method thereof
  • Fingerprint cover plate module and manufacturing method thereof

Examples

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Embodiment 1

[0035] This embodiment provides a preferred fingerprint cover module to solve the problem that the existing fingerprint cover module has a single color and poor matching with the mobile phone panel. Such as figure 1 As shown, the fingerprint cover module includes a glass cover 1, one side of the glass cover 1 is provided with a metal grating layer 6 and a non-metallic grating layer 3 in sequence, and the other side is provided with a protection ring 5, and the inside of the protection ring 5 is uniformly coated There is a transparent glue layer 4 on which a fingerprint chip 2 is pasted. Here, the opaque metal grating layer 6 is uniformly coated on the glass cover 1 by sputtering, and the opaque non-metallic grating layer 3 is coated on the metal grating layer 6 by surface spin coating. Both the metal grating layer 6 and the non-metal grating layer 3 are etched with small grating holes by photolithography process, which are used to realize the identification function of the fi...

Embodiment 2

[0039] Such as figure 2 As shown, this embodiment proposes a preferred manufacturing method of the fingerprint cover module, the method includes the following steps:

[0040] A. Making the whole piece of grating glass: prepare the whole piece of glass cover plate, and evenly coat one side of the whole piece of glass cover plate with an opaque non-metallic layer, and then use photolithography to engrave the non-metallic layer in the light-transmitting area etched away to make a grating layer on the entire glass cover;

[0041] Preferably, the grating layer in this embodiment further includes a metal grating layer disposed between the non-metallic grating layer and the glass cover, so this step specifically includes the following three sub-steps:

[0042] A1. Prepare the entire glass cover, and sputter or evaporate a layer of opaque metal layer on the entire glass cover;

[0043] A2. Spin coating or spraying a layer of opaque non-metallic layer on the surface of the metal lay...

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Abstract

The invention discloses a fingerprint cover plate module, and relates to the technical field of semiconductor packaging. The fingerprint cover plate module comprises grating glass and a fingerprint chip, wherein the grating glass comprises a glass cover plate, one side of the glass cover plate is provided with a grating layer, the other side of the glass cover plate is provided with a protection ring, the protection ring is internally coated with a glue layer, and the fingerprint chip is glued to the internal part of the protection ring through the glue layer; and the grating layer comprises a light-proof nonmetal grating layer. Meanwhile, the invention discloses a manufacturing method of the fingerprint cover plate module. The manufacturing method comprises the steps of A, manufacturing a whole piece of grating glass; B, setting a protection ring; C, gluing the fingerprint chip; D, laminating the fingerprint chip; and E, cutting. The fingerprint cover plate and the manufacturing method thereof enrich the color selection space of the grating layer and effectively improve matching between the fingerprint cover plate module and a mobile phone panel on the one hand, and increase the size of a fingerprint module on the other hand, thereby enabling a fingerprint recognition operation of a user to be more accurate and more sensitive, and effectively improving the user experience in use.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a fingerprint cover module and a manufacturing method of the fingerprint cover module. Background technique [0002] With the advancement of technology, the fingerprint recognition function has attracted more and more attention, and is widely used in fields such as mobile phones, cameras, and display devices. The grating glass in the existing fingerprint cover module generally uses opaque metal as the light-blocking layer of the grating, and then etches small holes by photolithography. The color of the grating glass produced in this way is relatively single, resulting in less color selection of the produced fingerprint cover and poor matching with the mobile phone panel. In addition, the existing manufacturing method of the fingerprint cover module is as follows: making bumps or protective rings on the entire wafer chip, and then attaching (or embedding) a single...

Claims

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Application Information

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IPC IPC(8): G06K9/00
CPCG06V40/1324
Inventor 吕军朱文辉赖芳奇王邦旭沙长青刘辰
Owner 苏州科阳半导体有限公司
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