Fingerprint module manufacturing method

A production method and technology of fingerprint modules, which are applied in the directions of acquiring/organizing fingerprints/palmprints, character and pattern recognition, instruments, etc., can solve the problem of high probability of fingerprint module deviation and bubbles, poor flatness, and long production time and other problems, to achieve the effect of improving the quality and work efficiency of the module, reducing the probability of fitting deviation and the degree of deviation

Inactive Publication Date: 2017-01-04
SHENZHEN TINNO WIRELESS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for making a fingerprint module, aiming to solve the problems of high probability of deviation and air bubbles, poor flatness and long production time during the production process of the fingerprint module

Method used

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Embodiment Construction

[0029] In order to enable those skilled in the art to better understand the technical solution of the present invention, a method for manufacturing a fingerprint module provided by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0030] like figure 1 Shown is a schematic flow chart of the manufacturing method of the fingerprint module of the present invention, and the manufacturing method of the fingerprint module specifically includes the following steps:

[0031] refer to figure 1 and figure 2 , S1: providing a substrate 111, and uniformly printing ink on the first surface 1111 of the substrate 111;

[0032] Among them, the substrate 111 may include but not limited to glass substrates, ceramic substrates and sapphire substrates. Specifically, the material can be selected according to actual needs, and the present invention is not limited; the substrate 111 may include but not limited ...

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Abstract

The invention discloses a fingerprint module manufacturing method. The method comprises: a substrate is provided, and ink is printed on a first surface of the substrate evenly; a fingerprint chipset is provided, and adhesive is spread on a chip sensing surface of the fingerprint chipset; the first surface of the substrate is attached to the chip sensing surface of the fingerprint chipset, and a chip module is produced; the chip module is cut into a plurality of unit chip modules. Through the method, the attaching bias probability and bias degree are reduced during fingerprint module manufacturing, so that the probability of bubble appearance and the number of bubbles appearing during fingerprint module manufacturing are reduced; and the adhesive is spread on the whole chipset, so that the chip adhesive thickness is consistent, thus the flatness of the fingerprint module is consistent, the manufacturing time is shortened, and the quality and work efficiency of the fingerprint module are improved.

Description

technical field [0001] The invention relates to the technical field of touch screens, in particular to a method for manufacturing a fingerprint module. Background technique [0002] In the field of touch screen technology, fingerprint recognition has the characteristics of high uniqueness, high stability, high accuracy, and high security. Therefore, fingerprint recognition is widely used in the field of touch screen technology and has great market potential. [0003] In the prior art, the fingerprint identification module with a cover is mostly used: first cut a large cover and a fingerprint chip set into a single cover and a single chip according to the required size, and then attach the single cover and a single chip The fingerprint film group produced by this production method has poor consistency, and it is easy to produce deviation and air bubbles when laminating, and because the glue thickness of each chip cannot be guaranteed to be consistent, the flatness of the fing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/12
Inventor 李毅杨清泉倪漫利
Owner SHENZHEN TINNO WIRELESS TECH
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