A bridge lead frame assembling device and assembling process thereof

A technology of lead frame and bridge lead, which is applied in the field of automation equipment, can solve the problems of low bonding efficiency, misalignment of two lead frames, high failure rate, etc., and achieve the effects of improving work efficiency, improving bonding efficiency, and stable quality

Active Publication Date: 2018-08-21
SHANDONG CAIJU ELECTRONICS TECH CO LTD
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Problems solved by technology

The current assembly process usually needs to be completed manually, that is, the lead frame coated with solder paste is manually stacked on the welding die. Due to the high requirements for assembly, the efficiency of the staff is extremely low, and the stacking and During the transfer process of the welding mold, it is easy to cause dislocation of the two lead frames, and the failure rate is high

Method used

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  • A bridge lead frame assembling device and assembling process thereof
  • A bridge lead frame assembling device and assembling process thereof
  • A bridge lead frame assembling device and assembling process thereof

Examples

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Embodiment Construction

[0033] Figure 1~7 It is the best embodiment of the present invention, below in conjunction with attached Figure 1~7 The present invention will be further described.

[0034] A bridge lead frame combination device, comprising a lead frame input mechanism 2 and a combination mechanism 4, there are two lead frame input mechanisms 2, and the two lead frame input mechanisms 2 are symmetrically arranged on both sides of the combination mechanism 4, and the two lead The frame input mechanism 2 transports the lead frames coated with solder paste to the sheet combination mechanism 4 respectively, and the sheet combination mechanism 4 stacks the lead frames on the welding mold 28 . The lead frame input mechanism 2 of the lead frame combination device of this bridge can deliver the lead frame coated with solder paste to the combination mechanism 4, and the combination mechanism 4 stacks two lead frames on the welding mold 28 to complete the lead frame The combined piece replaces the ...

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Abstract

A bridge lead frame chip combining device and a chip combining process thereof, and belongs to the technical field of automated equipment. The bridge lead frame chip combining device is characterized by comprising lead frame feeding mechanisms (2) and two chip combining mechanisms (4), wherein the two lead frame feeding mechanisms (2) are symmetrically arranged on two sides of the chip combining mechanisms; the two lead frame feeding mechanisms (2) respectively convey lead frames coated with tin cream to the chip combining mechanisms (4); and the lead frames are stacked on a welding die (28) by the chip combining mechanisms (4). By the bridge lead frame chip combining device, automated operation is realized, and working efficiency is improved greatly; and the lead frames can be simultaneously conveyed by the two lead frame feeding mechanisms, so that the lead frame conveying speed is increased, and chip combining efficiency is improved. The chip combining process of the bridge lead frame chip combining device is simple, the two lead frame feeding mechanisms simultaneously fed the lead frames for the chip combining mechanisms, the chip combining efficiency is high, and yield is also high.

Description

technical field [0001] A bridge lead frame combining device and a combining process thereof belong to the technical field of automation equipment. Background technique [0002] In the production process of the bridge, it is necessary to paint solder paste on the lead frame, then combine the two lead frames, and then weld the two lead frames, and the two lead frames need to be completely aligned during the welding process. The requirements for welding higher. The current assembly process usually needs to be completed manually, that is, the lead frame coated with solder paste is manually stacked on the welding die. Due to the high requirements for assembly, the efficiency of the staff is extremely low, and the stacking and During the transfer process of the welding mold, it is easy to cause dislocation of the two lead frames, and the failure rate is high. Contents of the invention [0003] The technical problem to be solved by the present invention is: to overcome the defi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/97H01L2224/95148H01L2224/97
Inventor 李向东
Owner SHANDONG CAIJU ELECTRONICS TECH CO LTD
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