Height-adjustable wafer bearing mechanism

An adjustable and height-adjustable technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of non-adjustable wafer support mechanism, etc., and achieve the effect of simple structure, safe and reliable positioning accuracy, and convenient disassembly and assembly

Inactive Publication Date: 2017-01-04
PIOTECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the above problems, the present invention designs a height-adjustable wafer supporting mechanism, which solves the problem that the existing wafer supporting mechanism cannot be adjusted

Method used

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  • Height-adjustable wafer bearing mechanism

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Embodiment

[0014] refer to figure 1 , a height-adjustable wafer support mechanism, including a hot plate 1, a ceramic sleeve 2, a ceramic column 3 and an adjustment wrench 4. The ceramic column 3 is formed with external threads; the ceramic sleeve 2 is formed with internal threads, and the ceramic sleeve 2 is threadedly connected with the ceramic column 3 .

[0015] The above-mentioned hot plate 1 is processed with a circular counterbore, and the ceramic sleeve 2 is put into the counterbore, and then the ceramic column 3 is screwed into the ceramic sleeve 2 with an adjustment wrench 4 . The top of the ceramic column 3 is shaped with a spherical protrusion, which matches the concave surface at the bottom of the adjustment wrench 4 .

[0016] The spherical protrusion at the top of the ceramic column 3 is used to support the wafer, the height between the spherical protrusion of the ceramic column 3 and the upper surface of the hot plate 1 is measured with a height gauge, and the adjustment...

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Abstract

The invention relates to a height-adjustable wafer bearing mechanism and solves the problem that an existing wafer bearing mechanism cannot be adjusted. The mechanism comprises a heating disc, a ceramic sleeve, a ceramic post and an adjustment wrench, wherein the ceramic post is provided with an external thread, the ceramic sleeve is provided with an internal thread, the ceramic sleeve is in threaded connection with the ceramic post, a round counter hole is formed in the heat disc, the ceramic sleeve is placed in the counter hole, the ceramic post is screwed into the ceramic sleeve by the adjustment wrench, a spherical-surface bulge is arranged at a top end of the ceramic post and is matched with a concave surface of the bottom of the adjustment wrench, the spherical-surface bulge at the top end of the ceramic post is used for bearing a wafer, the heights of the spherical-surface bulge of the ceramic post and an upper surface of the heat disc are measured by a height rule, the ceramic post is slightly adjusted by the adjustment wrench to reach a required height, and all bearing mechanisms on the heat disc are adjusted to the same height by the same method. The mechanism has the characteristics of simplicity in structure, high positioning accuracy, safety and reliability, is convenient to adjust, disassemble and assemble, and is mainly used in the technical field of semiconductor thin film deposition.

Description

technical field [0001] The invention relates to a wafer support mechanism for semiconductor coating equipment. The mechanism is mainly used in the normal temperature or high temperature process in the reaction chamber of the semiconductor coating equipment, and belongs to the application technical field of semiconductor thin film deposition. Background technique [0002] There needs to be a certain gap between the wafer and the hot plate of the semiconductor coating equipment, and the size of the gap has a great influence on the process result. The current wafer support mechanism cannot be adjusted, and it relies entirely on machining to ensure this gap. Due to errors in the processing process, the height of the support mechanism is inconsistent. When the error is too large, it will have a negative impact on the process results, and the negative impact cannot be eliminated. Contents of the invention [0003] In order to solve the above problems, the present invention desi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
CPCH01L21/68764
Inventor 柴智刘忆军
Owner PIOTECH CO LTD
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