The invention relates to a height-adjustable
wafer bearing mechanism and solves the problem that an existing
wafer bearing mechanism cannot be adjusted. The mechanism comprises a heating disc, a
ceramic sleeve, a
ceramic post and an adjustment
wrench, wherein the
ceramic post is provided with an external thread, the ceramic sleeve is provided with an internal thread, the ceramic sleeve is in threaded connection with the ceramic post, a round counter hole is formed in the heat disc, the ceramic sleeve is placed in the counter hole, the ceramic post is screwed into the ceramic sleeve by the adjustment
wrench, a spherical-surface bulge is arranged at a top end of the ceramic post and is matched with a
concave surface of the bottom of the adjustment
wrench, the spherical-surface bulge at the top end of the ceramic post is used for bearing a
wafer, the heights of the spherical-surface bulge of the ceramic post and an upper surface of the heat disc are measured by a height rule, the ceramic post is slightly adjusted by the adjustment wrench to reach a required height, and all bearing mechanisms on the heat disc are adjusted to the same height by the same method. The mechanism has the characteristics of simplicity in structure, high positioning accuracy, safety and reliability, is convenient to adjust, disassemble and assemble, and is mainly used in the technical field of
semiconductor thin film deposition.