Photoelectric sensor packaging piece, semi-finished product and batch packaging method

Abstract

The invention discloses a photoelectric sensor packaging piece, a semi-finished product and a batch packaging method. The photoelectric sensor packaging piece comprises a substrate with a signal leading-out end, wherein a control storage class chip communicating with the substrate, a luminous chip, a photosensitive receiving chip and a resistance-capacitance device are fixed on the substrate; light-transmitting adhesive layers are arranged on a luminous area of the luminous chip and a light receiving area of the photosensitive receiving chip respectively, and the top surfaces of the light-transmitting adhesive layers are planes and are overlapped with the top surfaces of lightproof plastic packaging layers wrapping the control storage class chip, the luminous chip, the photosensitive receiving chip and the resistance-capacitance device as well as gold threads, connected with the substrate, of the control storage class chip, the luminous chip, the photosensitive receiving chip and the resistance-capacitance device, arranged on the substrate. By setting the special lightproof plastic packaging layers, the isolation of the luminous chip and the photosensitive receiving chip is realized, and the interference of an external light source on photosensitive elements is avoided; moreover, the trustworthiness and reliability of the product are guaranteed by accurately controlling the top surface shapes and heights of the light-transmitting adhesive layers; and meanwhile, the components are highly integrated, and the dimensions of the whole packaging piece are greatly decreased.

Description

technical field [0001] The invention relates to a package, a first semi-finished product, a second semi-finished product, a third semi-finished product and a packaging method, in particular to a photoelectric sensor package, a first semi-finished product, a second semi-finished product, a third semi-finished product and a batch packaging method. Background technique [0002] The known photoelectric heart rate sensor is composed of an independently packaged light-emitting LED and an independently packaged phototransistor; since the light-emitting LED and the phototransistor are two completely independent packages, the installation distance of the two packages is too close to be installed in application, and the installation distance is too far The space occupied will be very large, and at the same time, the optical signal will be greatly attenuated. [0003] There will be errors every time during the installation process of the two packages, so the final installation position...

AI Technical Summary

Problems solved by technology

[0008] However, the processing flow of this method is cumbersome, the processing mold is complicated, and the packaging cost is high. It is not suitable for one-time batch packaging, and the packaging efficiency is low; and, because the shell is formed before packaging, the size of the final packaged product relatively bigger

[0009] At the same time, due to the complexity and difficulty in controlling the thickness of the light-transmitting adhesive layer and the amount of glue, it is difficult to ensure that the light-transmitting adhesive layer can effectively protect the light-emitting chip and the photosensitive receiving chip; The shape and thickness of the light-emitting chip cannot be effectively controlled and there is no effective follow-up treatment, so the propagation direction of the light emitted by the light-emitting chip cannot be fully controlled, resulting in a decrease in the reliability of the photoelectric sensor

[0010] These problems have caused great design investment and cost pressures for back-end application companies, and to a certain extent limit the wide application of photoelectric sensors in smart watches, smart bracelets, smart phones, portable medical instruments and other products

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