Packaging structure for film volume acoustic wave filter and packaging method

Abstract

The invention discloses a packaging structure for a film volume acoustic wave filter and a packaging method. The packaging structure comprises a substrate and a chip, wherein a chip electrode is correspondingly connected with a substrate electrode through flip chip; a film layer is fixedly spliced on the surface of the substrate; the film layer is clung to the surface of the substrate and is wrapped on the chip. The packaging method comprises the following steps: 1) dividing a chip packaging area on the substrate; 2) respectively welding the electrode on the to-be-packaged substrate with the corresponding electrode in the corresponding area through a flip-chip bonding technique; 3) pasting a protecting film on the substrate and wrapping all the chips; 4) raising temperature, splicing and curing the protecting film; 5) cutting the substrate, thereby acquiring the film volume acoustic wave filter. According to the invention, the chips are prevented from being polluted, the microminiaturization is realized and the processing efficiency is increased.

Description

technical field [0001] The invention relates to a film bulk acoustic wave filter (FBAR), in particular to a miniaturized packaging technology for a film bulk acoustic wave filter (FBAR), and belongs to the technical field of acoustic wave filters. Background technique [0002] At present, the miniaturized packaging of film bulk acoustic wave filter (FBAR) adopts the packaging form of potting resin packaging. In the future, there will be higher requirements for miniaturized packaging, and the potting resin is difficult to control the pollution problem. The thin-film bulk acoustic wave filter has high requirements on the working surface and cannot be polluted. Therefore, the packaging form of the potting resin is difficult to meet the needs of actual use. There is also a packaging structure that uses parallel welding of the ceramic shell, that is, a deep cavity structure is made on the shell, the bare chip is bonded in the deep cavity, and the lead wire is electrically conne...

AI Technical Summary

Problems solved by technology

Although such a packaging structure meets the requirement that the device cannot be polluted, there are at least two disadvantages in the following aspects: 1. It is difficult to miniaturize the device. At present, the smallest ceramic shell is 1.6mmX1.2mm and the thickness is more than 1mm. In the future mobile devices 2. The processing efficiency is low, because each device needs to be processed separately, and there is nitrogen and air replacement in order to keep the chip in a clean and non-polluted environment. Therefore, the packaging efficiency is relatively low

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