Radio frequency remote module and radio frequency base station

A radio frequency remote module and radio frequency technology, applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating modification, electrical components, etc., can solve the problems of low temperature resistance, product volume and weight cannot be reduced, and achieve heat dissipation High efficiency, reduce mutual influence, avoid the effect of heat radiation and heat convection

Active Publication Date: 2017-01-11
SHENZHEN SAMSUNG COMM TECH RES +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In the prior art, the RRU generally adopts a two-layer structure, that is, a power amplifier circuit board is set in one layer structure, and a transceiver circuit board is set in another layer structure. The distance between the circuit boards is relatively close. When the output power is relatively large, because the power amplifier circuit board is relatively hot, it will conduct heat convection and heat radiation to the opposite transceiver circuit board. Due to the low temperature resistance of the transceiver circuit board, it becomes The heat dissipation bottleneck makes the volume and weight of the product unable to be reduced

Method used

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  • Radio frequency remote module and radio frequency base station
  • Radio frequency remote module and radio frequency base station
  • Radio frequency remote module and radio frequency base station

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[0021] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0022] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] Such as figure 1 As shown, it is a schematic structural diagram of an embodiment of a radio remote module provided by the present invention. In this embodiment, the radio frequency proximity module includes: a filter module 3 and...

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Abstract

According to the embodiment of the invention, a radio frequency remote module is provided, comprising a filter module, a power amplifier module and a transceiver module. The power amplifier module and the transceiver module are arranged respectively on the two sides of the filter module. The filter module communicates with the transceiver module through a digital signal connector adapter; the filter module communicates with the power amplifier module through a radio frequency adapter. The invention also provides a corresponding radio frequency base station. According to the invention, it is possible to reduce the influence of the power amplifier module on the temperature of the transceiver module. The module of the invention is highly integrated.

Description

technical field [0001] The invention relates to a radio frequency connection structure of a mobile communication device, in particular to a radio remote module and a radio base station. Background technique [0002] In a mobile communication device, a remote radio unit (Remote Radio Unit, RRU) usually includes a power amplifier module (Power Amplifier, PA) and a transceiver (Transceiver, TRX). [0003] In the prior art, the RRU generally adopts a double-layer structure, that is, a power amplifier circuit board is set in one layer of structure, and a transceiver circuit board is set in another layer of structure, because in the two-layer structure, the power amplifier circuit board and the signal transceiver The distance between the circuit boards is relatively close. When the output power is relatively large, because the power amplifier circuit board is relatively hot, it will conduct heat convection and heat radiation to the opposite transceiver circuit board. Due to the lo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/3827H04W88/08H05K7/20
CPCH04B1/38H04W88/085H05K7/2039
Inventor 郑光野高飞鞠金培朱本明赵广鑫
Owner SHENZHEN SAMSUNG COMM TECH RES
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