Dressing apparatus and dressing method of polishing pad of double-side polishing apparatus

Abstract

The invention discloses a dressing apparatus and a dressing method of polishing pad of a double-side polishing apparatus. The purpose is to provide a dressing apparatus capable of uniformly dressing a polishing pad. The apparatus includes first and second dressing grind stones 51 and 52 which grind polishing pads 17 and 18 by moving in a radial direction of upper and lower polishing plates 12 and 14 while abutting on corresponding polishing pads 17 and 18, in which the first and second dressing grind stones 51 and 52 are set so as to have: an inner side region portion P; an outer side region portion Q; and an intermediate region portion R, wherein the length of each of the inner side region portion P and the outer side region portion Q extending in a circumferential direction of the polishing plates 12 and 14 is longer than the length of the intermediate region portion R extending in a circumferential direction of the polishing plates.

Description

technical field [0001] The invention relates to a dressing device and a dressing method for a grinding pad of a double-sided grinding device. Background technique [0002] Grinding of a workpiece such as a semiconductor wafer is performed by pressing the surface of the workpiece to be ground into contact with the surface of the polishing pad on a polishing plate to which the polishing pad is attached and by rotating the polishing plate while supplying a polishing liquid to the polishing pad. . [0003] Then, after the grinding is finished, grinding waste or slurry has infiltrated into the grinding pad, thereby reducing the grinding rate, and thus, generally, for each batch of grinding, high-pressure cleaning water is sprayed to the grinding pad in order to wash away all Infiltrated grinding waste or grinding fluid (Patent Document 1). Also, even if the polishing pad is cleaned for each batch of polishing, the polishing pad typically suffers from undulations (concave-convex...

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Problems solved by technology

[0005] However, even if the polishing pad is cleaned by spraying high-pressure cleaning water for each batch of grinding, unevenness is gradually formed in the polishing pad in each batch, thereby reducing the grinding rate of the workpiece

In addition, although the grinding rate was restored by grinding the grinding pad by using a correction grindstone to make the grinding pad flat after performing seven batches of grinding, the grinding rate was not kept constant, and the grinding degree was adjusted via the grinding time, by The problem with this is that the controls are cumbersome and it is difficult to perform precise grinding

Also, there is a problem in that it takes nearly 15 to 20 minutes each time to replace the carrier with a ring-shaped correcting grindstone after performing seven batches of grinding and to perform the dressing operation, and thus, the working efficiency is poor.

Moreover, there is a problem that the life of the polishing pad is also short because a dressing operation of grinding the polishing pad by use of a correcting grindstone needs to be performed every after seven batches of grinding

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