Thin vapor chamber

Abstract

The invention discloses a slim vapor chamber including a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed on an inner wall of the chamber. At least one of a side of the first plate facing the second plate and / or a side of the second plate facing the first plate is formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process. The slim vapor chamber can improve the flow speed of the evaporated working fluid so as to enhance the heat conducting efficiency between the two plates so as to enhance the heat conducting ability. Therefore, the vapor chamber can have a thinner size and a good efficiency, thereby providing a better heat conducting ability to the electronic product.

Description

technical field [0001] The invention relates to a heat conduction device, in particular to a thin uniform temperature plate. Background technique [0002] Due to the continuous development of electronic products such as portable, light and thin, 4K video, 4G transmission, and high additional functions, high-performance electronic products will generate a lot of waste heat when they are in operation. If the heat conduction elements and / or heat dissipation are not improved The effectiveness of the components, that is, it may cause damage to the internal components of the electronic product, reducing the efficacy or service life of the electronic product. [0003] In order to solve the heat conduction and / or heat dissipation problems of high-efficiency electronic products, the heat conduction technology of the vapor chamber has been developed now. Through the gas phase change and flow heat transfer of the working fluid inside the vapor chamber, the heat energy is diffused to th...

AI Technical Summary

Problems solved by technology

However, in terms of production, it is difficult to place and position the support columns, and it is easy to cause misalignment after joining, which will affect the internal steam movement and further affect the performance of the vapor chamber.

Furthermore, the steam heat transfer is relatively non-directional (steam is not directional), resulting in a large temperature difference between the hot and cold ends of the vapor chamber. Therefore, when making the vapor chamber lighter and thinner, it is necessary to effectively guide the steam. To improve the efficiency of heat conduction

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