Method for asynchronous production of semi-glue products by gap machine

Abstract

The invention discloses a clearance machine and a method for asynchronously producing a semi-colloidal product through the clearance machine. The technical problems existing in the existing process mentioned in the background technology are solved. According to the technical scheme, the clearance machine comprises a working table rack, a die-cutting machine, a material A placing mechanism, a material A bottom membrane rolling mechanism, a material B placing mechanism, a material gluing mechanism, a material C placing mechanism, a product waste discharge mechanism and a product rolling mechanism. The method for asynchronously producing the semi-colloidal product through the clearance machine includes the following steps that (1) a material A and a material B are placed; (2) the material A and the material B are glued; (3) release paper carried out on the material A is scraped; (4) a material C is placed; (5) die cutting is carried out; (6) waste discharge is carried out; and (7) product collection is carried out.

Description

technical field [0001] The invention relates to a method for asynchronously producing semi-glue products by using a gap machine. Background technique [0002] In the photoelectric display thin-film devices, precision die-cutting equipment is required for die-cutting products used in backlight modules or liquid crystal displays. At present, TFT-LCD display panels are developing rapidly, and there is a strong demand for photoelectric display thin-film devices. Especially for precision die-cutting of difficult products, there is an urgent need for process innovation. For the research on the production of irregular-shaped semi-glue products, the original process is complicated, and multiple die-cutting machines are distributed in one piece for die-cutting. The first die-cutting machine die-cuts out the inner layer of partial colloid, removes excess colloid, and then lamination The machine is covered with another material and enters the second die-cutting machine for punching an...

AI Technical Summary

Problems solved by technology

[0004] 1. The cost of die cutting is high;

[0005] 2. High labor cost;

[0006] 3. Low production capacity and high defect rate;

[0007] 4. There are indentations in the die-cutting of products with a size smaller than 5mm;

[0008] 5. For products with special shapes, the material waste in the die-cutting process is serious;

[0009] 6. Multiple times of manual waste removal is required, and a product requires at least 4-5 people to cooperate to complete;

[0010] 7. The number of required machines is large, and the depreciation cost of equipment is high

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