Water-cooled row structure

Abstract

The invention relates to a water cooling bus structure. The water cooling bus structure comprises at least one first sealing member, at least one second sealing member and a first water cooling bus body formed by multiple first heat radiation members through lamination, wherein the first sealing member, the multiple first heat radiation members and the second sealing member are sequentially laminated in a heat processing mode to form one body, one sides of the first / second sealing members are respectively connected with upper and lower sides of the first water cooling bus body so as to seal an inner portion of the first water cooling bus body to form a top side having at least one first flow channel and a bottom side, at least one first combination portion is selectively arranged at the first sealing member or one end of the first flow channel, at least one second combination portion is selectively arranged at the first sealing member or the other end of the first flow channel, and the first combination portion and the second combination portion are communicated and are opposite to the first flow channel.

Description

【Technical field】 [0001] The invention relates to a water-cooled radiator structure, in particular to a water-cooled radiator structure with multiple flexible designs and good heat dissipation effect. 【Background technique】 [0002] With the rapid development of high-tech industries such as computer information and the expansion of their application scope, the speed of data processing by computer devices is also getting faster and faster. At present, the volume of electronic components inside computer equipment tends to be miniaturized, and the density of integrated circuits (ICs) is also relatively increased, which leads to a relatively increased heat generated per unit area. If the large amount of heat energy generated by the electronic components is not dissipated in time, it will cause damage to the electronic components and make the computer device unable to operate. [0003] In order to reduce the operating temperature of heating electronic components, a water-cooled ...

AI Technical Summary

Problems solved by technology

[0004] Although it is known that the heat of the working liquid in the flat tubes 42 of the water cooling row 4 will be conducted to the heat dissipation fins 41 for heat dissipation, another problem arises, that is, the heat of the working liquid is conducted to the heat dissipation fins The heat transfer efficiency of the fins 41 is not good, because the fins 41 and the flat tubes 42 are two independent components welded by soldering, so the fins 41 are not part of the flat tubes 42 themselves. A part, so that the flat tubes 42 conduct heat to the cooling fins 41, there will be thermal resistance, so that the flat tubes 42 will transfer the heat absorbed by the water cooling liquid to the cooling fins 41 on both sides. The heat conduction efficiency of the water-cooled row 4 is not good, which in turn leads to the problem that the heat-dissolving efficiency of the entire water-cooled row 4 is reduced (or the heat exchange efficiency is reduced)

In addition, since the heat dissipation fins 41 are welded to the outsides of the flat tubes 42 on both sides through the outside of the bending point, the structural strength of the middle part 411 of the heat dissipation fins 41 is relatively weak, and it is easy to be impacted by external force and cause damage. damage (such as deformation), and the heat conduction effect between the flat tubes 42 and the heat dissipation fins 41 is also very unsatisfactory

[0005] Furthermore, the known water-cooled radiator 4 is composed of three independent components, making the assembly process complicated and time-consuming and labor-intensive.

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