Shock absorption apparatus and circuit board assembly

Abstract

The invention relates to the electronic technical field, and discloses a shock absorption apparatus and a circuit board assembly. According to the embodiments of the invention, the first surface of the shock absorption apparatus with a hollow interior is in contact with a to-be-fixed panel equipped with at least one fixing hole while the second surface of the shock absorption apparatus is in contact with a fixed plane, so that the shock absorption apparatus is positioned between the to-be-fixed panel and the fixed plane; and the to-be-fixed panel passes through the fixing hole and the shock absorption apparatus through a fixing part to be fixed on the fixed plane, so that the shock absorption apparatus is positioned between the fixing hole of the to-be-fixed panel and the fixed plane. According to the embodiments of the invention, by additionally arranging the shock absorption apparatus between the fixing hole of the to-be-fixed panel and the fixed plane, vibration buffering between the to-be-fixed panel and the fixed plane is formed, so that the vertical vibration amplitude transferred to the to-be-fixed panel through the fixing part is lowered, and the vibration impact on the overall to-be-fixed panel is weakened.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a shock absorbing device and a circuit board assembly. Background technique [0002] In the process of assembling microelectronic packaging devices into printed circuit boards (Print Circuit Board), the connection between devices and PCB is usually in the form of solder ball array BGA (Ball GridArray) or pins, and electrical and mechanical connections are realized by soldering. A variety of devices are often installed on the PCB, and the size of the devices is relatively small, on the order of centimeters to millimeters. It is difficult and uneconomical to design shock absorption for a single device. [0003] Usually, the PCB passes through the fixing hole through the fixing part and is fixed in a plane position. The vibration is mainly transmitted to the PCB through the fixing part, and then affects the reliability of the soldering point of the device, such as figure 1 As s...

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Problems solved by technology

[0005] However, in the process of realizing the present invention, the inventors of the present application found that the underfill solution has the following problems: (1) the underfill is usually a poor conductor, which is not good for the heat dissipation of active devices; (2) the underfill The thermal expansion rate of the device is larger than that of the device, which may cause additional thermal stress at high temperature; (3) In some harsh environments, such as applications with high temperature and long time, the problem of rubber aging is prone to occur, and the vibration protection effect is lost

The scheme of connecting with a spring piece makes the distance between the device and the PCB relatively large, which increases the occupied area of ​​the device, which is not conducive to the current trend of high integration

The chassis and shock-absorbing ring scheme with springs increase the shock-absorbing structure, which not only increases the cost, but also is not compatible with most PCB surface-mounted device structures

Springs and non-metal material buffer devices can alleviate the vibration transmitted from the vibration source to the fixed object through a fixed position, but the non-metal film is added for buffering, which is not stable enough and the structure is relatively complicated

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