Film laminating machine

Abstract

The invention provides a film pasting and pressing integration machine. The machine comprises an upper plate form, a lower platform and a transmission and turning device. The upper platform comprises a hard substrate, a first flexible material covering the hard substrate and a second flexible material covering the first flexile material. Multiple groove channels are formed in the first flexible material. Multiple first openings are formed in positions, corresponding to the grooves, of the second flexible material. The groove channels are connected with a vacuum pump. The lower platform comprises a substrate. Second openings are formed in the substrate. One end of each second opening is connected with the vacuum pump. The transmission and turning device is connected between the upper platform and the lower platform and used for up-down transmitting the upper platform and controlling turning of the platform. According to the invention, by using the film pasting and stitching integration machine to paste films, film pasting precision can be effectively controlled; film pasting time is shortened; and an air bag is used for pressing the films, so gas in the films can be effectively squeezed out and bubbles and folds can be reduced.

Description

technical field [0001] The invention relates to a semiconductor device, in particular to an all-in-one film sticking and pressing machine. Background technique [0002] In the semiconductor packaging industry, film packaging mainly uses thin film materials of different materials, which are attached to the material to be packaged to effectively protect the material to be packaged from external influences such as scratches and oxidation. Therefore, the film sticking process is an important step in semiconductor manufacturing. A commonly used process. [0003] At present, most of the manual film application methods require high operator proficiency, are prone to air bubbles and wrinkles, and take a long time. [0004] figure 1 It is shown as an existing film sticking process, which usually includes the following steps: [0005] The first step is to spread the substrate on a flat workbench; [0006] In the second step, the film is slowly attached to the substrate; [0007] ...

AI Technical Summary

Problems solved by technology

[0010] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a film lamination machine, which is used to solve the problem that the film lamination process in the prior art is carried out manually, which requires skilled operation, takes a long time, and the process of laminating the film Bubbles and wrinkles are prone to appear in the

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