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A waterproof packaging structure and packaging process for LED array devices

A technology of LED array and packaging structure, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of destroying sealant sealing, time-consuming and laborious packaging process, affecting LED light emission, etc., to increase waterproof sealing performance and high waterproof level. , the effect of simple process

Active Publication Date: 2018-03-27
NANJING JULI INTELLIGENT MFG TECH INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The rubber sealing ring has an aging cycle, and the sealant is prone to yellowing, aging, and embrittlement after being exposed to light for a long time, which destroys the sealing performance of the sealant
After aging, the sealing ability will decrease, moisture will slowly infiltrate into the sealing cavity, and a layer of fog will be formed on the lens, which will seriously affect the light emission of the LED, seriously affect the reliability of the LED, and shorten the service life of the LED packaging structure
[0004] On the other hand, designing a complex packaging structure will lead to an increase in the cost of manufacturing LEDs and a time-consuming and laborious packaging process.

Method used

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  • A waterproof packaging structure and packaging process for LED array devices
  • A waterproof packaging structure and packaging process for LED array devices
  • A waterproof packaging structure and packaging process for LED array devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] A waterproof packaging structure for LED array devices, including multiple sealed partitions 6, the multiple sealed partitions 6 include a first sealed partition 6.1 and a second sealed partition 6.2; moisture absorption rings 9 are arranged on the first sealed partition 6.1 and the second sealed partition Partition between 6.2. The sealing flange portion 3.2 includes an integrally formed inverted L-shaped vertical sealing portion and a horizontal sealing portion, the inner surface of the vertical sealing portion constitutes the first sealing surface 3.21, and the horizontal surface of the horizontal sealing portion constitutes the second sealing surface 3.22 ; The sealing flange part 3.2 and the lens array part are made of transparent glass. The sealing flange part 3.2 comprises a first sealing surface 3.21 and a second sealing surface 3.22. The second sealing surface 3.22 is provided with an intrusion groove 3.23 in a closed ring shape. The substrate package board 4...

Embodiment 2

[0069] The sealing flange part 3.2 and the lens array part 3.1 of the lens module 3 are integrally formed, but the sealing flange part 3.2 is made of metal, and the lens array part 3.1 is made of glass.

[0070] The first sealant is replaced by a weld, and the first sealing partition 6.1 is a weld. The welding seam is solder material, or resin material.

[0071] Other structures are the same as in Embodiment 1.

Embodiment 3

[0073] A waterproof packaging structure for LED array devices, including multiple sealed partitions 6, the multiple sealed partitions 6 include a first sealed partition 6.1, a second sealed partition 6.2 and a third sealed partition 6.3. The hygroscopic ring 9 is arranged between the first sealing partition 6.1 and the third sealing partition 6.3. The third airtight partition 6.3 is arranged inside the second airtight partition 6.2. The lens module 3 includes a lens array part 3.1 and a sealing flange part 3.2, the sealing flange part 3.2 is arranged perpendicular to the lens array part, and the two are integrally formed, and the sealing flange part 3.2 and the lens array part are both Made of clear glass. The sealing flange part 3.2 The sealing flange part 3.2 includes an integrally formed inverted L-shaped vertical sealing part and a horizontal sealing part, the inner surface of the vertical sealing part constitutes the first sealing surface 3.21, and the horizontal sealing...

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PUM

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Abstract

The invention discloses a waterproof packaging structure of an LED array device. The waterproof packaging structure is arranged between a substrate packaging plate and a lens module, and comprises a plurality of sealing partition walls; the sealing partition walls comprise first sealing partition walls and second sealing partition walls; a moisture-absorbing ring belt is arranged between the first sealing partition walls and the second sealing partition walls; a sealing flange part of the lens module comprises a first sealing surface and a second sealing surface; a squeezing groove or an annular bulge of the second sealing surface is sealed with a second sealing groove of the substrate packaging plate, and is annularly filled with a second sealant to form the second sealing partition walls; a moisture-absorbing ring belt sealing ring is annularly arranged in a side groove of the substrate packaging plate; the first sealing partition walls are formed on the first sealing surface between the side faces of the outer side of the side groove; two / three sealing partition walls are matched with the moisture-absorbing ring belt in the middle to take a synergistic effect, and IP6 grade or more than IP6 grade of waterproof grade is reached, so that the waterproof performance is greatly improved, and the service life of an LED is prolonged.

Description

technical field [0001] The invention relates to the technical field of LED array devices, in particular to a waterproof packaging structure of LED array devices and a packaging process thereof. Background technique [0002] As an active self-luminous device, LED is a solid-state lighting that does not burn filaments or gases. It has low power consumption, low operating voltage, high luminous brightness, long working life, and stable performance. It can work in extreme environments with little performance attenuation. Due to its characteristics, it has been widely used. Since multiple shadows are reduced when multiple LEDs are gathered, the tight gathering of LEDs, that is, LED array devices, came into being. The application of LEDs has ranged from narrow signal indication to LCD TVs, backlights, mobile phones, lighting, computers, etc., which are widely used now. The LED packaging industry is an indispensable and important part of the entire LED industry. The manufacturing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/00
CPCH01L33/005H01L33/48H01L33/54
Inventor 马如宏汤沛夏基胜
Owner NANJING JULI INTELLIGENT MFG TECH INST CO LTD