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Semiconductor device and optical coupling device

A technology for semiconductors and light-emitting parts, which is applied to semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., and can solve problems such as different thermal expansion coefficients and light-emitting chip peeling.

Active Publication Date: 2020-09-11
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the first resin part and the second resin part usually have different coefficients of thermal expansion, if the adhesion between the first resin part and the second resin part is high, the stress from the second resin part may be applied, causing the light-emitting chip to peel off. Yu

Method used

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  • Semiconductor device and optical coupling device
  • Semiconductor device and optical coupling device
  • Semiconductor device and optical coupling device

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no. 1 Embodiment approach

[0020] Figure 1A is a perspective view of the optical coupling device 1 of the present embodiment, Figure 1B yes Figure 1A Sectional view of line A-A. The optical coupling device 1 of the present embodiment includes: a first bonding pad 3 , a second bonding pad 4 , and a third bonding pad 5 respectively arranged separately on a substrate 2 ; and a light receiving chip provided on the first bonding pad 3 . 6. The light-emitting chip 7 arranged on the light-receiving chip 6, the first MOSFET (Metal Oxide Semiconductor Field Effect Transistor, Metal Oxide Semiconductor Field Effect Transistor) 8 arranged on the second pad 4, and the first MOSFET (Metal Oxide Semiconductor Field Effect Transistor) arranged on the third pad 5 The upper second MOSFET9, the gel-like silicone 10 covering the surface of the light-emitting chip 7, and the resin part 11 covering the surface of the silicone 10. The first MOSFET 8 and the second MOSFET 9 are power semiconductor elements such as IGBT (I...

no. 2 Embodiment approach

[0044] In the second embodiment, the rubber-like silicone 10 is used to prevent the peeling of the light emitting chip 7 .

[0045] The optical coupling device 1 of the second embodiment has the same configuration as that of FIG. 1 . Figure 4 is a schematic cross-sectional view of the periphery of the light-emitting chip 7 and the light-receiving chip 6 . Such as Figure 4 As shown, the surface of the light-emitting chip 7 stacked on the light-receiving chip 6 and part of the bonding wire 16 connected to the light-emitting chip 7 and the light-receiving chip 6 are covered with rubber-like silicone 10 . The silicone 10 is covered with a resin portion 11 including epoxy resin or the like. Figure 5 It is an enlarged cross-sectional view schematically showing the vicinity of the interface between the rubber-like silicone 10 and the resin portion 11 .

[0046] The rubber-like silicone 10 of the present embodiment has different thicknesses on the upper surface side and the side...

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Abstract

According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.

Description

[0001] [Related applications] [0002] This application enjoys the priority of the basic application based on Japanese Patent Application No. 2015-175055 (filing date: September 4, 2015). This application includes the entire content of the basic application by referring to this basic application. technical field [0003] Embodiments of the present invention relate to a semiconductor device and an optical coupling device. Background technique [0004] There is known an optical coupling device in which a light-emitting chip is provided on a light-receiving chip. In this type of optical coupling device, the surface of the light-emitting chip is covered with the first resin portion in order to protect the light-emitting chip. Furthermore, the surface of the first resin part is covered with the second resin part. [0005] However, since the first resin part and the second resin part usually have different coefficients of thermal expansion, if the adhesion between the first res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L23/31H01L25/16
CPCH01L23/296H01L23/3135H01L25/167H01L23/373H01L23/49811H01L23/49827H01L24/32H01L31/00H01L31/16H01L2224/32501H01L2224/32505H01L2924/06
Inventor 鹰居直也
Owner KK TOSHIBA