Dual-image-sensor packaging module and formation method therefor

Abstract

The invention discloses a dual-image-sensor packaging module and a formation method therefor. The formation method comprises the steps of providing a substrate, wherein the substrate comprises a first surface and a second surface opposite to the first surface, and the substrate has an interconnecting line; providing a first image sensor and a second image sensor, wherein an image sensing region and a bonding pad which surrounds the image sensing region are arranged on the front surface of each of the first image sensor and the second image sensor separately; setting the first image sensor and the second image sensor on the same surface of the substrate, wherein the bonding pad of the first image sensor is electrically connected with the interconnecting line while the bonding pad of the second image sensor is electrically connected with the interconnecting line; and forming welding lug bosses on the first surface and the second surface of the substrate, wherein the welding lug bosses are electrically connected with the interconnecting line; the welding lug bosses are used for being electrically connected with an external circuit; and the convex direction of the welding lug bosses is opposite to the front surface direction of the first image sensor and the second image sensor. By adoption of the scheme, the integration degree of the module is improved while the image acquisition precision is improved.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to a double image sensor packaging structure and a packaging method thereof. Background technique [0002] Image sensors receive light signals from objects and convert them into electrical signals that can be transmitted for further processing, such as digitization, and then stored in a storage device such as memory, optical or magnetic disks, or for display on a display display etc. Image sensors are commonly used in devices such as cell phones, digital cameras, camcorders, scanners, fax machines, and the like. Image sensors generally include charge-coupled device (CCD) image sensors and CMOS image sensors (CIS, CMOS Image Sensor). Compared with CCD image sensors, CMOS image sensors have the advantages of high integration, low power consumption, and low production cost. [0003] An existing image sensor module includes: a substrate, the substrate includes a front surface and...

AI Technical Summary

Problems solved by technology

[0005] However, as people have higher and higher requirements for the clarity of images obtained by cameras, the existing method of obtaining images through a single camera can no longer meet the requirements. For this reason, dual-camera technology has been developed. The existing dual-camera technology Usually, the two image sensor modules are respectively connected to corresponding devices (such as mobile phones) to realize the function of dual cameras.

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