A kind of LED encapsulation structure and preparation method thereof

A technology for LED packaging and LED chips, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as affecting the life of LED packaging devices, low thermal conductivity of LED chips, and inability to effectively conduct phosphors, so as to improve spatial color temperature distribution, Improve light conversion efficiency and solve the effect of thermal failure

Active Publication Date: 2019-12-06
APT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of the LED chip is low and cannot effectively conduct the heat of the phosphor powder, so more heat will be loaded on the phosphor powder, which will inevitably cause serious failure of the phosphor powder, and finally affect the life of the entire LED packaging device.

Method used

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  • A kind of LED encapsulation structure and preparation method thereof
  • A kind of LED encapsulation structure and preparation method thereof
  • A kind of LED encapsulation structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] This embodiment discloses an LED packaging structure 1, such as Figure 5-11 As shown, it includes an LED chip 11 , an LED carrier 12 , a light conversion layer 13 and an outer protective layer 14 , and the LED chip 11 is disposed on the LED carrier 12 .

[0061] The LED packaging structure 1 also includes a transparent silicone layer 15 , which is wrapped between the light conversion layer 13 and the LED chip 11 , and the transparent silicone layer 15 becomes a supporting platform for the light conversion layer 13 .

[0062] The thickness of the light conversion layer 13 located above the transparent silica gel layer 15 gradually decreases from the central area to the surrounding area, that is, this part of the light conversion layer 13 forms a structure that is thick in the center and thin in the periphery. The light conversion layer 13 located on the side wall of the transparent silica gel layer 15 The thickness gradually increases from top to bottom, which effective...

Embodiment 2

[0081]This embodiment discloses another LED packaging structure 2, and its structural difference from the LED packaging structure 1 described in Embodiment 1 lies in:

[0082] In this example, if Figures 14 to 17 As shown, according to the optical performance requirements, the surface of the fourth transparent silica gel layer 154 located above the LED chip 11 is concave downward and has a hemispherical shape, and the fifth transparent silica gel layer 155 located on the side wall of the LED chip 11 presents an outwardly flared slope. shape.

[0083] Based on the above-mentioned structural design, combined with the characteristics of the light conversion layer 13 as a fluid, the light conversion layer 13 located in the middle area above the LED chip 11 is also thicker, and the peripheral area is thinner. The light conversion layer located on the side of the LED chip 11 The thickness of 13 gradually increases from top to bottom, thereby effectively reducing the optical path d...

Embodiment 3

[0088] This embodiment discloses another LED package structure 3, which differs from the LED package structure 1 described in Embodiment 1 in terms of structure:

[0089] In this example, if Figures 19-22 As shown, the sixth transparent silica gel layer 156 located above the LED chip 11 is in the shape of a slope with high surroundings and a low middle, and the surface is X-shaped, and the seventh transparent silica gel layer 157 located on the side wall of the LED chip 11 is outwardly opened. Slope-like, similar to cutting two grooves along two diagonal lines on the surface of the transparent silicone layer 15 .

[0090] Based on the above-mentioned structural design, combined with the characteristics of the light conversion layer 13 as a fluid, the light conversion layer 13 located in the middle area above the LED chip 11 is also thicker, and the peripheral area is thinner. The light conversion layer located on the side of the LED chip 11 The thickness of 13 gradually incr...

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Abstract

The invention discloses an LED packaging structure, which comprises an LED chip, an LED carrier, a light conversion layer, an outer protective layer and a transparent silica gel layer, wherein the LED chip is arranged on the LED carrier; the transparent silica gel layer coats between the light conversion layer and the LED chip; the thickness of the light conversion layer at the upper part of the transparent silica gel layer is gradually reduced from a center region to the periphery; the thickness of the light conversion layer on the side wall of the transparent silica gel layer is gradually increased from top to bottom; and the outer protective layer coats the light conversion layer. The invention further discloses a preparation method of the LED packaging structure. According to the LED packaging structure disclosed by the invention, distribution of the light conversion layer on the periphery of the LED chip is improved; the space color temperature uniformity of an LED device is improved; the problem of a heating failure of the light conversion layer is solved; and according to a preparation method of the LED packaging structure, mechanized production is achieved, the packaging steps are simple and massive production can be achieved.

Description

technical field [0001] The invention belongs to the technical field of light-emitting diode (LED) packaging, and in particular relates to an LED packaging structure and a preparation method thereof. Background technique [0002] Light-emitting diode (LED) is an electroluminescent device processed by semiconductor manufacturing technology. It is widely used in various fields, including backlight units, automobiles, electrical signals, traffic lights, and lighting devices. It is known as an alternative to fluorescent lamps and incandescent lamps. The fourth generation lighting source of the lamp. [0003] The mainstream commercial white LEDs currently on the market are realized by using blue LED chips plus one or more of yellow phosphor, green phosphor, and red phosphor. Specifically, the blue light emitted by the LED chip under the current drive excites the phosphor , so that it produces visible light in other bands, which is mixed with blue light to form white light. [00...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/52H01L33/56H01L33/60
CPCH01L33/507H01L33/508H01L33/52H01L33/56H01L33/60H01L2933/0041H01L2933/005H01L2933/0058
Inventor 曾照明陈智波侯宇姜志荣万垂铭肖国伟
Owner APT ELECTRONICS
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