Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
A copper electrolytic and acidic technology, applied in the field of copper electroplating bath, can solve the problems of low internal stress, high ductility, etc., and achieve high ductility and increase predictability
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example 1
[0036] Prepare the following aqueous acidic copper electroplating bath.
[0037] surface
[0038]
[0039]
[0040] The composition of the copper electroplating baths was made using conventional laboratory procedures in which the organics were added to the water followed by the addition of the inorganic components. Stirring or agitation with heating is performed at a temperature below 30°C to ensure that all components are dissolved in the water. The bath was allowed to reach room temperature prior to copper plating. The pH of the acidic copper electroplating bath ranges from less than 1 to 1 at room temperature and during copper electroplating.
example 2
[0042] Two flexible copper alloy foil test strips were dielectric coated on one side, enabling single-sided plating on the uncoated side. The test strips were taped to a support substrate with plating tape and placed in a Haring cell containing an acidic copper plating bath having the recipe for Bath 1 in the table in Example 1. The bath was kept at room temperature. A strip of copper metal is used as the anode. The test foil strips and anodes are connected to the rectifier. The test foil strips were copper plated at an average current density of 2ASD to deposit a copper thickness of 5 μm on the uncoated side of each strip. After plating was complete, the test strips were removed from the Harlem cell, rinsed with water, dried and the plating tape was removed from the test strips. The internal stress of the copper deposit on the strip was measured to be 838 psi. Internal stress can be determined using the equation S=U / 3TxK, where S is the stress in psi and U is the number o...
example 3
[0044] Example 3 (comparison)
[0045] Two flexible copper / beryllium alloy foil test strips were dielectric coated on one side, enabling single-sided plating on the uncoated side. > The test strips were taped to a support substrate with plating tape and placed in a Harlem cell containing acidic copper plating bath 2 . The bath is at room temperature. A strip of copper metal is used as the anode. The test foil strips and anodes are connected to the rectifier. The test foil strips were electroplated with copper at an average current density of 2 ASD to deposit a copper thickness of 5 μm on the uncoated side of each strip. After plating was complete, the test strips were removed from the Harlem cell, rinsed with water, dried and the plating tape was removed from the test strips. Insert one end of the test strip into the screw clamp of the Sediment Stress Analyzer. The internal stress of the copper deposit on the strip was measured to be 211 psi. Internal stress can be deter...
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