Tool for verifying rise-and-fall repetitiveness of heating base in semiconductor device and method for verification

Abstract

The invention discloses a tool for verifying rise-and-fall repetitiveness of a heating base in a semiconductor device, aiming at addressing the undesirable repetitiveness of the rise-and-fall height caused by influence on the heating base by the machining inaccuracy of machine-made spares. The tool uses an entire material to remove materials, such that a circular thick-plate material forms a depressed station having an edge with an outer trim. The plate at the bottom part of the depressed station is perforated, and the plate among apertures is evenly provided with dial indicators. The machining tolerance of form and position requirement is used to limit the parallel level between the lower surface of the outer trim of the edge of the circular thick-plate material and the upper surface of the bottom part of the depressed station. According to the invention, the tool aims at verifying the repetitiveness of the rise-and-fall of the heating base, verifying the machining precision of the machine-made spares in a rise-and-fall mechanism of the heating base, and the properties and quality of an electric sliding table or servo motor, and determining whether the properties of the heating base assembly can reach standards, and ensures that the rise-and-fall mechanism of the heating base is qualified before the semiconductor device is on market. The tool has a simple structure to verify the repetitiveness of the rise-and-fall mechanism of the heating base which is assembled by a plurality of parts in cooperation. Before the semiconductor device is on market, the took can ensure the reliability of the rise-and-fall mechanism of the heating base.

Description

Technical field [0001] The invention relates to a verification tool for the lifting and lowering repeatability of a heating substrate in a semiconductor device, which is mainly applied to the verification operation of the lifting movement of a heating plate in a semiconductor coating device, and belongs to the technical field of semiconductor thin film deposition application and preparation. Background technique [0002] Existing semiconductor coating equipment mostly uses a disc-shaped heating substrate to heat wafers or other forms of thin film substrates in the process. In addition, these heating substrates also need to move up and down when wafers or other forms of thin film substrates are transported. Since the lifting motion of the heating substrate is mostly realized by the way of machined parts and electric sliding table or servo motor drive, the repeatability of the heating substrate is affected by the machining accuracy of the machined parts, the performance and quality...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the above-mentioned problems, and mainly solve the problem of the unsatisfactory repeatability of the lifting height caused by the influence of the processing accuracy of the machined parts and other reasons on the heating base in the prior art

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