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Integrated laser chip

A chip and laser technology, applied in the direction of lasers, laser devices, laser components, etc., can solve the problems of complex shaping of laser arrays, and achieve the effects of simple shaping optical paths, reduced manufacturing costs, and simplified assembly processes

Pending Publication Date: 2017-04-05
韩涛
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the complex problem of post-shaping of existing laser arrays, the present invention provides a circularly symmetric semiconductor laser array

Method used

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Experimental program
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Embodiment 1

[0083] Such as figure 1 As shown, this embodiment provides a circularly symmetric semiconductor laser array, which includes a base 110 . Wherein, a plurality of ring-shaped roof structures 150 are constructed on the base 110, and the central axes of any two roof structures 150 are coincident; the side surfaces of any roof structure 150 are center-symmetrically provided with semiconductor laser chips.

[0084] In this embodiment, a substrate 120 for fixing the ridge structure 150 is provided inside the base 110 , and a circuit board for placing a semiconductor laser chip is provided inside the substrate 120 . The semiconductor laser chip is eutectically welded to the substrate 120, and the semiconductor laser chip is connected to the gold wire on the circuit board. A temperature sensor is provided inside the base 110 in contact with the substrate 120. The temperature sensor in this embodiment is a thermocouple temperature sensor. The temperature sensor is used to collect the o...

Embodiment 2

[0089] This embodiment provides a white semiconductor laser array, which is different from Embodiment 1 in that the semiconductor laser chips include a red semiconductor laser chip 131, a green semiconductor laser chip 132, and a blue semiconductor laser chip 133, and Semiconductor laser chips of the same color are arranged on the same roof structure 150 .

[0090] In addition, in this embodiment, the power ratio of the red semiconductor laser chip 131 , the green semiconductor laser chip 132 , and the blue semiconductor laser chip 133 is 1:0.86:0.52.

Embodiment 3

[0092] Such as figure 2 As shown, this embodiment also provides a white light semiconductor laser array, which is different from Embodiment 2 in that: the semiconductor laser chips are arranged in a rectangular shape, and the roof structure 150 includes a plurality of rectangular blocks arrayed in a rectangular shape.

[0093] In addition, in this embodiment, the red semiconductor laser chips 131 , the green semiconductor laser chips 132 , and the blue semiconductor laser chips 133 are arranged alternately.

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PUM

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Abstract

The invention relates to a semiconductor laser array technology field and more particularly, to an integrated laser chip. The chip comprises a frame structured housing. The opening at the lower end of the housing is provided with a dielectric substrate; and the opening at the upper end of the housing is provided with a transparent output window. The medium substrate is provided and distributed with connection lines. Semiconductor laser chips in connection with the connection linesupper are arrayed on the upper part of the dielectric substrate and the light emitting faces of the semiconductor laser chips face right the output window. The medium substrate is further provided with pins and the pins provide power to the semiconductor laser chips through the connection lines. According to the invention, it is possible to integrate a laser into a chip so that the laser becomes small sized; with high reliability, the standardization of the laser chip is increased greatly.

Description

technical field [0001] The invention relates to the technical field of semiconductor laser arrays, in particular to an integrated laser chip. Background technique [0002] There are two main types of visible laser light sources used in the field of laser display and lighting: semiconductor pumped solid-state lasers and semiconductor lasers. As the power of semiconductor lasers continues to increase, the shortcomings of semiconductor pumped solid-state lasers, such as high laser speckle, harsh working environment requirements, and high cost, are becoming more and more prominent. Therefore, the development trend of laser sources tends to be more and more semiconductor lasers. [0003] At present, there are three main packaging methods for semiconductor lasers: single-tube LD, bar bar and semiconductor laser array. Among them, the light output power of single-tube LD is low, so it needs to rely on the quantity to make up for the shortcoming of insufficient power of the single ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/40H01S5/022
CPCH01S5/405H01S5/02355
Inventor 赵振宇
Owner 韩涛