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Method And Device For Laser Processing Of Transparent Materials

A technology of transparent materials and laser beams, applied in the laser field, can solve the problems of increased material loss of workpieces, decreased mechanical strength of workpieces, decreased productivity and processing speed, etc., to improve processing quality, improve processing quality, and improve workpiece material productivity Effect

Active Publication Date: 2017-04-12
UAB ALTECHNA R&D
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, due to the formation of random cracks and stresses branching from cracking tracks in the bulk and surface of the workpiece, the mechanical strength of the processed workpiece decreases, the loss of workpiece material increases, and the productivity and processing speed decrease

Method used

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  • Method And Device For Laser Processing Of Transparent Materials
  • Method And Device For Laser Processing Of Transparent Materials
  • Method And Device For Laser Processing Of Transparent Materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] The device for carrying out laser processing to transparent material that has realized the method of the present invention comprises:

[0036] - a laser source 1 which generates an ultrashort pulse Gaussian intensity distribution laser beam 2,

[0037] - Optical elements (3, 3', 3") for transforming a Gauss-Bessel intensity profile ultrashort pulse laser beam into an asymmetric Gauss-Bessel intensity profile laser beam,

[0038] - controlled turning means (4a, 4b) to guide the damaged area 18b in the required direction within the workpiece 7 while forming the cutting and / or fracture plane trajectory,

[0039] - an optical system 5, forming a Gauss-Bessel intensity distribution laser beam and localizing it within a workpiece 7, said workpiece 7 being transparent to the localized laser beam,

[0040] - the table 8, capable of linear movement, is controlled by a controller 10 which receives control commands from the computer 9,

[0041] - optical elements 11 for generati...

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Abstract

The present invention relates to a method and device for laser processing of transparent materials. The method comprises the steps of placing an optical element in a light path of a Gaussian or Gaussian-Bessel intensity distribution laser beam, converting an ultra short pulse Gaussian intensity distribution laser beam into an asymmetric Gaussian-Bessel intensity distribution laser beam, wherein the asymmetry of the asymmetric Gaussian-Bessel intensity distribution laser beam is set by selecting the appropriate material of the optical element, and / or the parameter of the optical element and / or the position of the optical element in the laser beam light path, so that the elongate Gaussian-Bessel intensity distribution laser beam is formed in a plane vertical with the propagation direction of the laser beam. The corresponding elongate damage areas in a workpiece are induced, and the controlled shift of the workpiece and the laser beam relative to each other is carried out in the following manner that the induced elongate damage areas are arranged vertically and orderly along a predetermined track of a cutting and / or break plane in the workpiece.

Description

technical field [0001] The invention relates to the field of lasers, that is, transparent materials are processed, and transparent materials (including glass, chemically tempered glass, sapphire) can be processed by using an ultrashort pulse asymmetric Gauss-Bessel (Gauss-Bessel) intensity distribution laser beam and other crystalline materials) for cutting, breaking and other processing. Background technique [0002] Most methods and devices for cutting, scribing or breaking transparent materials are based on focusing a laser beam generated by a laser source onto the surface of the transparent material or into a bulk of the transparent material, forming a crack in the transparent material, This causes the transparent material to separate or break due to external forces. [0003] International patent application WO20122006736 (January 19, 2012) discloses a method for pre-cutting transparent materials, which includes the following steps: directing an ultrashort pulse laser b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/04B23K26/08B23K26/382B23K26/073B23K26/402
CPCB23K26/062B23K26/0622B23K26/0624B23K26/064B23K26/082B23K26/364B23K26/382B23K26/0626B23K26/0736B23K26/402C03B33/0222Y02P40/57B23K26/53C03B33/072C03B33/082B23K26/0006B23K26/0648B23K26/0652B23K26/0823
Inventor M·米库提斯
Owner UAB ALTECHNA R&D