Dynamic seal jacking structure for thin film deposition device

A thin film deposition and dynamic sealing technology, applied in ion implantation plating, gaseous chemical plating, coating, etc., can solve the problems of complex design, increased assembly difficulty, difficult maintenance, etc., and achieve easy maintenance, simple assembly, and simple sealing. effect of structure

Inactive Publication Date: 2017-05-03
PIOTECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the previous design of moving parts in the cavity, the design was often complicated in order to ensure the sealing of the moving part, the difficulty of assembly was increased, and the maintenance was difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dynamic seal jacking structure for thin film deposition device
  • Dynamic seal jacking structure for thin film deposition device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0012] refer to figure 1 and figure 2 , the present invention provides a dynamic seal jacking structure applied to thin film deposition equipment, the dynamic seal jacking structure includes a fixing device and a driving device, the fixing device includes a linear bearing seat 3 and a connecting base 4, the linear bearing seat 3 is fixedly connected with the reaction chamber 1, the drive device includes a support guide rod 2, a support guide rod connector 5 and a drive part 6, the support guide rod 2 is inserted into the linear bearing seat 3, and the drive part 6 is connected to the connection b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention belongs to the technical field of semiconductor thin film deposition application and preparation and particularly relates to a dynamic seal jacking structure for a thin film deposition device. The dynamic seal jacking structure for the thin film deposition device comprises a fixed device and a driving device. The fixing device comprises a linear bearing seat and a connection base. The linear bearing seat is fixedly connected with a reaction cavity. The driving device comprises a supporting guide rod, a supporting guide rod connecting piece and a driving component. The supporting guide rod is inserted into the linear bearing seat. The driving component is connected with the connection base. The connection base is connected with the linear bearing seat. The supporting guide rod is connected with the supporting guide rod connecting piece. A dynamic seal rubber ring is installed in a rubber ring groove of the linear bearing seat. A seal rubber ring is installed in a rubber ring groove of the linear bearing seat. According to the dynamic seal jacking structure for the thin film deposition device, a simple seal structure is adopted, a dynamic seal manner is utilized to meet the seal requirement existing when a moving connection rod moves, the dynamic seal jacking structure for the thin film deposition device is simplified, assembly of the whole thin film deposition device is easy and convenient, and the thin film deposition device is easy to maintain.

Description

technical field [0001] The invention belongs to the technical field of semiconductor thin film deposition application and preparation, and in particular relates to a dynamic sealing jacking structure applied in thin film deposition equipment. Background technique [0002] In the preparation of semiconductor thin films, there are some functional moving parts inside the reaction chamber, which are driven outside the chamber and driven by the lifting device to move. In the previous design of moving parts in the cavity, the design was often complicated in order to ensure the sealing of the moving part, making assembly more difficult and maintenance difficult. Contents of the invention [0003] In order to solve the above problems, the present invention provides a dynamic sealing jacking structure applied in thin film deposition equipment, adopts a simple sealing structure, utilizes the dynamic sealing form, solves the sealing requirements when the action connecting rod moves, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/56C23C16/44
CPCC23C14/564C23C16/4409
Inventor 姜巍关帅
Owner PIOTECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap