A photomask for spectral solder joint analysis and imaging after wave soldering
A wave soldering and spectroscopy technology, applied in the field of photomasks for spectral solder joint analysis and imaging after wave soldering
Active Publication Date: 2019-04-02
上海誉盈光电科技有限公司
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- Description
- Claims
- Application Information
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Problems solved by technology
From a process point of view, the wave soldering machine can only provide a little adjustment of the most basic equipment operating parameters
Method used
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Embodiment
[0020] Embodiment: a photomask for spectral solder joint analysis and imaging after wave soldering, its main structure includes: top sealing ring 1, cover bowl a2, cover bowl b3, cover bowl c4, photomask cylinder 5, bottom sealing ring 6. Rubber sealing ring a7, neodymium magnetic steel ring 8, connecting ring 9, rubber sealing ring b10, neodymium magnetic top ring 11, lens mounting point 12, rail frame fixing plate 13, metal sealing ring 14, sealing ring base 15, air Rod member 16, guide rail bar 17, rail groove 18, electric air rod 19, pin 20, inner silicon steel block 21, connector 22, outer silicon steel block 23, axle pin 24, block pin 25, described photomask tube Cover bowl a2, cover bowl b3, and cover bowl c4 are sequentially socketed on the top 5 through screw ports, and the cover bowl a2 is fixed with a top seal ring 1 through bolt rods;
[0021] A circle of outer silicon steel blocks 23 is arranged inside the outer cylinder composed of the cover bowl a2, cover bowl b...
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The invention relates to a photomask for welding spot analysis and imaging of a spectrum after wave soldering. The photomask is sequentially sleeved with a cover A, a cover B and a cover C through screws. A top seal cover ring is fixed to the cover A through a bolt rod. A circle of outer silicon steel blocks are distributed in an outer barrel formed by the cover A, the cover B and the cover C. Every two adjacent outer silicon steel blocks are fixedly linked through a hinge pin. The outer silicon steel blocks and inner silicon steel blocks are linked in a tensioned mode through connecting pieces. The outer silicon steel blocks and the cover B are fixed through pins. The photomask has the function of automatically repairing and recognizing welding spots of products passing through a wave soldering furnace, and the types which the photomask can repair include continuous tin electrodeposit, extra soldering and tin holes of the product welding spots; and after being detected by the photomask, the products with carriers enter a spraying mechanism of equipment, a spraying control part captures defective information automatically and sprays rosin water to the defective welding spots accurately, and the products enter the repairing stage.
Description
technical field [0001] The invention relates to a light mask for analyzing and imaging spectral solder joints after wave soldering. Background technique [0002] Wave soldering is to make the soldering surface of the plug-in board directly contact with high-temperature liquid tin to achieve the purpose of soldering. The high-temperature liquid tin maintains a slope, and a special device makes the liquid tin form a wave-like phenomenon, so it is called "wave soldering". The main material is solder bar. Wave soldering refers to spraying molten solder (lead-tin alloy) into the solder wave peak required by the design through an electric pump or electromagnetic pump. It can also be formed by injecting nitrogen into the solder pool, so that the pre-installed components The printed board realizes the soldering of the mechanical and electrical connection between the solder end of the component or the pin and the pad of the printed board through the solder wave. Wave soldering proc...
Claims
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IPC IPC(8): B23K3/00B23K3/08H05K3/34
CPCB23K3/00B23K3/08B23K2101/42H05K3/34
Inventor 余京烨
Owner 上海誉盈光电科技有限公司