Micro-dot electroplating tank for semiconductor silicon wafer

Abstract

The invention discloses a micro-dot electroplating tank for semiconductor silicon wafers, which comprises an electroplating cavity (1) and a plating solution tank (2); the electroplating cavity (1) is divided into an outer tank (11) and an inner tank (12), and the inner tank (12) An anode electrode plate (31) is placed on the inner side of the bottom, and the semiconductor silicon chip (4) to be plated is placed on 4 upward protrusions (13) evenly distributed on the top periphery of the inner tank (12), on which a cathode electrode plate (32) is placed; The plating solution circulation is formed through the plating solution tube (6) between the cavity (1) and the plating solution tank (2); the plating solution pump (5) is arranged in the plating solution tank (2), and the outlet of the plating solution pump (5) is connected to A liquid pipe (61) on the plating solution, the liquid pipe (61) on the plating solution passes through the outer tank (11) and the inner tank (12) and the anode electrode plate (31), and communicates with the inside of the inner tank (12); (11) has a liquid return hole (14), and the liquid return hole (14) is located outside the inner tank (12). In the electroplating bath of the present invention, large-scale semiconductor chips are uniformly electroplated with micro-dots without plating bumps or adhesions.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer electroplating tanks, in particular to a micro-dot electroplating tank for semiconductor silicon wafers which can realize uniform micro-dot electroplating of large-scale semiconductor chips without plating bumps or adhesions. Background technique [0002] Transistors, diodes and other semiconductor devices are widely used in mobile phones, computers and other fields. There are often more than 100,000 dies on a transistor or diode silicon chip, and a silver dot needs to be plated on the pin of each die for easy lead-in. Foot welding. [0003] Due to the small size and pitch of large-scale semiconductor chips, the existing electroplating equipment is prone to plating bumps or sticking during the electroplating process of silicon die pins. Contents of the invention [0004] The object of the present invention is to provide a micro-dot electroplating tank for semiconductor silicon wafers, whi...

AI Technical Summary

Problems solved by technology

[0003] Due to the small size and pitch of large-scale semiconductor chips, the existing electroplating equipment is prone to plating bumps or adhesions during the electroplating process of silicon die pins

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