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High-luminous-flux three-dimensional LED lamp

An LED chip, three-dimensional technology, applied in the field of high luminous flux LED three-dimensional body lamps, can solve the problems of heavy metal radiators, large light loss, large volume, etc., and achieve the effect of improving luminous flux, fast heat export speed, and low junction temperature

Inactive Publication Date: 2017-05-10
张中伟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As incandescent lamps are gradually banned in various countries, gradually eliminated, and faded out of the lighting field, LED lighting is gradually popularized and widely used due to the advantages of semiconductor light-emitting diode (LED) lighting, which are more energy-saving, green and environmentally friendly, and have a long service life. LED lighting fixtures need a heavy metal radiator if they want high power, which makes them large in size, medium in quality, high in cost, and relatively large in light loss.

Method used

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  • High-luminous-flux three-dimensional LED lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A high luminous flux LED three-dimensional volume lamp, comprising LED three-dimensional light emitting body 15, three-dimensional light-transmitting body 1, driver 11, driver housing 12, electrical connector 13; the number of described LED three-dimensional light emitting bodies is two, and each LED The shape of the three-dimensional illuminant is a cuboid whose top is a circular arc top, and each LED three-dimensional illuminant 15 is installed on the upper cover of the driver housing 12; the LED three-dimensional luminous body 15 includes a three-dimensional light-transmitting body 1 and a Groove 6, the inner surface of the groove is first coated with a transparent medium layer or a luminescent powder layer 7 mixed with luminescent powder, and a series of LED chips 4 are fixed with a transparent medium layer, and the LED chips 4 are connected in series or in parallel through electrical connecting wires 3 or a combination of series and parallel connections, the upper a...

Embodiment 2

[0021] The appearance of the LED three-dimensional luminous body in Example 1 can also be a cuboid with an arc top, such as figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 shown. figure 2 Two identical LED three-dimensional light emitters are installed on the upper cover of the driver casing. Each LED three-dimensional light emitter is made of two identical LED three-dimensional light emitters with a 7-shaped groove that is in contact with each other and is bonded with a transparent medium or melted at a high temperature. sealed into a whole. image 3 and Figure 4 It consists of two identical cuboid three-dimensional illuminants with arc tops and three 7-shaped grooves that are in contact with each other, and are bonded with transparent media or sealed at high temperature to form a whole. Figure 5 It is an LED three-dimensional illuminant, and a rectangular parallelepiped groove is provided on the LED three-dimensional illuminant. Figure 6 One LED three-dim...

Embodiment 3

[0023] The shape of the LED three-dimensional illuminant described in Embodiment 1 can also be a triangular prism, such as Figure 7 , Figure 8 shown; Figure 7 It is two identical LED three-dimensional light emitters, each LED three-dimensional light emitter has three grooves according to its three edges; Figure 8 It is an LED three-dimensional illuminant with three grooves on the sides of the triangular prism.

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Abstract

The invention discloses a high-luminous-flux three-dimensional LED lamp, which comprises at least one three-dimensional LED luminous body, a driver, a driver housing and an electrical connector, wherein the three-dimensional LED luminous body is mounted on an upper cover of the driver housing; the three-dimensional LED luminous body, the driver, the driver housing and the electrical connector are connected with one another to form the high-luminous-flux three-dimensional LED lamp; the three-dimensional LED luminous body comprises a three-dimensional light transmission body and at least one groove which can be sealed formed in the three-dimensional light transmission body; at least one string of LED chips is fixed in each groove; the LED chips are connected in series or in parallel or in series and in parallel through an electrical connecting wire; solder pads are arranged at the two ends of each groove, the solder pad at one end is connected with one end of the electrical connecting wire and an electrical outgoing wire respectively, the electrical outgoing wire is connected with an electrode lead, and the solder pad at the other end is connected with the other end of the electrical connecting wire and another electrode lead respectively; the electrode leads are connected with the output of the LED driver; the input of the LED driver is connected with the electrical connector; the electrical connector is used for connecting an external power supply. The high-luminous-flux three-dimensional LED lamp is long in service life and convenient to disassemble and maintain.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to an LED three-dimensional lamp with high luminous flux. Background technique [0002] As incandescent lamps are gradually banned in various countries, gradually eliminated, and faded out of the lighting field, LED lighting is gradually popularized and widely used due to the advantages of semiconductor light-emitting diode (LED) lighting, which are more energy-saving, green and environmentally friendly, and have a long service life. LED lighting fixtures need a heavy metal heat sink if they want high power, which makes them large in size, medium in quality, high in cost, and relatively large in light loss. At present, there are high-efficiency filament lamps on the market, but the filament is sealed in the bulb and relies on air-filled heat dissipation, the thermal resistance is relatively large, and the heat dissipation rate is slow. It is relatively difficult to obtain high ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/23F21K9/90F21V19/00F21V23/00F21V29/503F21V31/00F21Y115/10
CPCF21K9/90F21V19/001F21V19/002F21V23/003F21V23/06F21V29/503F21V31/00
Inventor 张中伟马飞飞
Owner 张中伟