Heating plate impedance measuring tool and heating plate impedance measuring method

Abstract

A heating plate impedance measuring tool and a heating plate impedance measuring method mainly settle technical problems of large measurement data error and overweak signals in an existing measuring method. The heating plate impedance measuring tool comprises an insulating assembly and an electrode assembly. The insulating assembly comprises an insulating block A, an insulating block B and a spring. The electrode assembly comprises an N connector socket positioning base, fixing screws, a connecting board, an insulating board, an electrode board A, an insulating base A, an insulating base B, an electrode board B, insulating sleeves and a spring. The N connector socket positioning base is connected with a network analyzer. The network analyzer outputs a quick frequency sweeping low-power electric signal through a port. The signal arrives at a heating plate through transmission of an RF cable and generates a reflected electric signal. The impedance ZL of the heating plate can be obtained through measuring a complex reflection coefficient. The heating plate impedance measuring tool and the heating plate impedance measuring method have advantages of reasonable structure, convenient operation method, reliable measurement result, and effective stability improvement in heating plate impedance measurement. The heating plate impedance measuring tool and the heating plate impedance measuring method can be widely used in the technical field of semiconductor film plating equipment.

Description

technical field [0001] The invention relates to a tool for measuring the impedance of a heating plate and a measuring method. Specifically, an electrode plate is used to connect the heating plate and a cavity respectively, and an insulating block is used to separate the heating plate and the cavity, so that the heating plate can be easily installed in the cavity for measurement. Tooling structure and measurement method of medium impedance. The invention belongs to the application technical field of radio frequency impedance measurement of semiconductor equipment. Background technique [0002] With the increase in demand for electronic products, the rapid development of semiconductor equipment is driven. The heating plate is a key component widely used in the silicon wafer deposition reaction chamber in semiconductor equipment. The impedance of the heating plate directly affects the distribution of each ion field during the silicon wafer deposition process, thereby affecting...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the above problems, mainly to solve the technical problems of large measurement data errors and weak signals in the existing measurement methods, and to provide a measuring tool for the impedance of the heating plate, which increases the connection between the output signal of the network analyzer and the heating plate and the cavity. The contact area strengthens the measurement signal and improves the accuracy and stability of the impedance measurement of the heating plate

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