LTCC (Low-temperature co-fired ceramic) filter manufacturing method and LTCC filter

A technology of filters and intermediate conductors, which is applied in the field of printed components, can solve the problems of low electrical connection rate of LTCC filter ports, low electrical connection rate, and increased manufacturing costs, and achieve microwave performance and consistency of various indicators. The effect of improving product qualification rate and electrical connection rate

Active Publication Date: 2017-05-10
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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AI Technical Summary

Problems solved by technology

[0003] However, in the actual production process of LTCC filters, the poor electrical connection performance of the side ports is one of the important factors affecting the product qualification rate
The low electrical connection rate leads to a low yield of LTCC microwave filters, and the highest pass rate can only reach 50%, which greatly increases the manufacturing cost and seriously restricts the mass production and large-scale application of LTCC microwave filters.
The low electrical connection rate of the LTCC filter port is caused by the poor connection between the conductors on the side end and the end of the intermediate layer conduction band, and the thin thickness of the intermediate layer conductor port is the root cause of the electrical connection failure of these two parts. reason

Method used

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  • LTCC (Low-temperature co-fired ceramic) filter manufacturing method and LTCC filter
  • LTCC (Low-temperature co-fired ceramic) filter manufacturing method and LTCC filter

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Embodiment Construction

[0027] The following examples are a further description of the content of the present invention as an explanation of the technical content of the present invention, but the essential content of the present invention is not limited to the following examples, those of ordinary skill in the art can and should know any Simple changes or replacements of the essential spirit of the invention shall fall within the scope of protection required by the present invention.

[0028] In the LTCC filter, the sintering thickness of the intermediate conductor layer is designed to be about 8 μm. After measurement, it is found that the exposed thickness of the end of the conduction band of the intermediate layer of the finished filter after sintering is very thin, and the outline of the exposed conduction band is very vague, and part of it is covered by the ceramic material. cover.

[0029] It is for this reason that the exposed terminal is in poor contact with the printed conductor on the side....

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Abstract

The invention discloses a LTCC (Low-temperature co-fired ceramic) filter manufacturing method and an LTCC filter. The thickness of an exposed terminal of a middle conductor layer is increased to achieve the design standard after sintering, and the conduction rate of the LTCC filter after terminal printing is ensured. The product qualification rate of the LTCC filter after improvement is greatly enhanced to be 97% from the original 50%, and the cost is greatly reduced. Besides, the electrical connection rate of the LTCC filter port is improved, and the microwave performance of the filter and the consistency of each index are greatly improved.

Description

technical field [0001] The invention belongs to the technical field of printing components for providing electrical connection between printed circuits or printed circuits, and in particular relates to a preparation method of an LTCC filter and the LTCC filter. Background technique [0002] Low-temperature co-fired ceramic (Low-temperature co-fired ceramic, LTCC) technology is to make low-temperature sintered ceramic powder into a green ceramic tape with precise thickness and density, which is used as a circuit substrate material, and punch holes on the green tape. Microhole filling, precision conductive paste printing, lamination, lamination and other processes produce the required circuit pattern, and multiple passive components are embedded in it, then laminated together, and sintered at high temperature to form a three-dimensional circuit The passive integrated components of the network can also be made into a three-dimensional circuit substrate with built-in passive com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/205H01P11/00
CPCH01P1/205H01P11/007
Inventor 杨靖鑫吴申立章瑜李建辉宗志峰
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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