Seamless transferring material supply device for plate packaged component

Abstract

The invention discloses a seamless transferring material supply device for plate packaged component. The device comprises the following mechanisms mounted on the frame connection mechanism: an automatic material changing mechanism, a plate packaged component saving mechanism and a placing and material supplying mechanism. The automatic material changing mechanism and the placing and material supplying mechanisms are arranged at two sides of the plate packaged component saving mechanism. The device of the invention has the following beneficial effects: 1) small in size and low in height: occupying small space and having a compact structure enabling the device to be built in a placing machine transfer plate guide rail's moving side and to move along with the guide rail at the moving side; high in flexibility; since the height and the placing surface are at the same level, collision with the placing head is avoided; 2) large in capacity meaning that eight plates of materials could be saved at one time, therefore, reducing the times of changing the material plates and eight kinds of different plate packaged components could be dealt with easily; 3) automatic material changing without closing down the machine and the placing speed much fast; when the material plates need to be replaced, the automatic material changing mechanism automatically transfers the empty plates to the external part of the machine, making the device more secure; and 4) the reduced cost of the entire device.

Description

technical field [0001] The invention relates to a disk-mounted component feeding device in the chip mounter industry, in particular to a disk-mounted component seamless connection feeding device. Background technique [0002] Placement machine: also known as "mounting machine" and "surface mount system". In the production line, it is configured after the dispensing machine or screen printing machine, and the surface mount components are accurately placed by moving the placement head A device on a PCB pad. [0003] In the past, there were mainly two types of tray-mounted component feeding devices in the placement machine industry: 1. Built-in small tray-mounted feeding devices; 2. External large-scale tray-mounted feeding devices. [0004] The disadvantages of the above two devices are: (1) Built-in small tray loading device: at most two trays can be loaded at the same time, and the machine must be stopped to change the tray loading, which affects the speed of the whole mach...

AI Technical Summary

Problems solved by technology

[0004] The disadvantages of the above two devices are: (1) built-in small tray loading device: at most two trays can be loaded at the same time, and the machine must be shut down to change the tray loading, which affects the speed of the whole machine; (2) the external Large-scale tray feeding device: large volume, long feeding stroke, poor stability, and very high cost

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