Packaging glue film without flanging and with good bonding

A kind of encapsulating adhesive film, good technology, applied in the field of solar cells, can solve problems such as poor bonding of the backplane, lower module output power, and battery sheet shading, etc., achieve good appearance, control shrinkage rate, and increase power generation.

Active Publication Date: 2017-05-17
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve this problem, there is now a white EVA packaging film on the market to replace the original transparent EVA packaging film, but the pure white EVA packaging film is prone to poor adhesion to the backplane during the lamination process. The problem of delamination with EVA; in addition, during the lamination process, EVA melts and flows, and some white EVA will overflow to the front of the cell, which will cause the cell to be partially blocked, and will also reduce the output power of the module

Method used

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  • Packaging glue film without flanging and with good bonding
  • Packaging glue film without flanging and with good bonding
  • Packaging glue film without flanging and with good bonding

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0026] This embodiment provides an encapsulating adhesive film with no flanging and good adhesion, which includes a first transparent layer 1, a middle non-transparent layer 2 and a second transparent layer 3 arranged in sequence, the first transparent layer 1, the middle non-transparent layer 2 and the second transparent layer 3 are independently EVA, POE or a polymer substrate mixed with POE and LDPE; the polymer substrate of the middle non-transparent layer 2 also contains inorganic pigment powder.

[0027] Wherein, the thickness of the first transparent layer 1 (that is, the A1 layer) is 200 μm, and its specific components are: the polymer substrate is POE (DOW company XUS38660, 100 wt%), and the following components are added in the mass fraction thereof: Parts: TBEC (acrylic curing agent, tert-butylperoxycarbonate-2-ethylhexyl) 0.7wt%, TAIC (assistant crosslinking agent, triallyl isocyanurate) 0.7wt%, coupling Agent OFS-6030: 0.6wt%, light stabilizer Tinuvin 770: 0.3wt%,...

Embodiment 2

[0031] This embodiment provides a kind of encapsulating adhesive film with no flanging and good adhesion, its structure is consistent with that of Embodiment 1, and the composition and thickness of the first transparent layer 1 and the second transparent layer 3 are also the same as those of Embodiment 1. The same as in , the difference is that a different intermediate non-transparent layer 2 is used, specifically:

[0032] The thickness of the middle opaque layer 2 (i.e. B layer) is still 300 μm, but its specific components are: the polymer substrate is POE (DOW company XUS38660, 70wt%), LDPE (2426H, 20wt%) and titanium dioxide (10wt%) %) composition, the following components are also added in the mass fraction: TBEC: 0.63wt%, TAIC: 0.63wt%, 6030: 0.54wt% and 770: 0.27wt%.

Embodiment 3

[0034] This embodiment provides a kind of encapsulant film with no flanging and good adhesion, its structure is consistent with that in embodiment 2, and the composition and thickness of the middle non-transparent layer 2 (i.e. B layer) are also the same as in embodiment 2 The difference is that the first transparent layer 1 and the second transparent layer 3 in the middle are used, specifically:

[0035] The thickness of the first transparent layer 1 is 200 μm, and its specific components are as follows: the polymer substrate is composed of POE (38660, 80wt%) and LDPE (2426H, 20wt%), and the following components are added in the mass fraction thereof: Parts: TBEC (acrylic curing agent, tert-butylperoxycarbonate-2-ethylhexyl) 0.7wt%, TAIC (assistant crosslinking agent, triallyl isocyanurate) 0.7wt%, coupling Agent 6030: 0.6wt%, light stabilizer 770: 0.3wt%, ultraviolet absorber (CYASORB UV-531) 0.35wt%.

[0036] The thickness of the second transparent layer 3 (that is, the A2...

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Abstract

The invention relates to a packaging glue film without flanging and with good bonding. The packaging glue film comprises a first transparent layer, an intermediate non-transparent layer and a second transparent layer which are successively arranged. The first transparent layer, the intermediate non-transparent layer and the second transparent layer are mutually independent EVA, POE or POE and LDPE mixing polymer base materials. The polymer base material of the intermediate non-transparent layer contains inorganic pigment powder. Through using the first transparent layer, the intermediate non-transparent layer and the second transparent layer of specific components, a problem that the packaging glue film is easy to overflow (flange) can be solved; and a purpose of controlling a shrinking percentage can be achieved, a laminated assembly appearance is good and finally generation power is increased.

Description

technical field [0001] The invention belongs to the field of solar cells, and relates to an encapsulating adhesive film for solar cells, in particular to an encapsulating adhesive film with no flanging and good peeling off. Background technique [0002] Since the birth of life on earth, it has mainly survived on the heat radiation energy provided by the sun. Since ancient times, humans have also known to use sunlight to dry objects and use it as a method of making food, such as making salt and drying salted fish. With fossil fuels decreasing day by day, solar energy has become an important part of the energy used by human beings and has been continuously developed. [0003] Since the solar cell is used outdoors and the environment is harsh, it needs to be protected. It is usually packaged with structures such as glass, encapsulation film, and backplane. The function of the encapsulation film is to connect the glass and the backplane while encapsulating the solar cell. The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/048
CPCY02E10/50H01L31/0481
Inventor 王磊陈洪野宇野敬一吴小平
Owner CYBRID TECHNOLOGIES INC
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