Radiator and communication products
A technology of radiator and cooling fins, applied in the field of communication, can solve the problems of reducing the heat dissipation efficiency of the heat dissipation teeth and increasing the weight of the heat dissipation capacity of the whole machine, and achieve the effect of improving the heat dissipation efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0037] Embodiments of the present invention will be described below in conjunction with the accompanying drawings.
[0038] see figure 1 , figure 2 and Figure 6 The heat sink in one embodiment of the present invention includes a base plate 10 and a plurality of tooth plates 20 , and the plurality of tooth plates 20 are arranged at intervals on the base plate 10 to form a heat dissipation fin structure. Specifically, a plurality of tooth pieces 20 are arranged at equal intervals. The substrate 10 is made of thermally conductive material, such as a metal plate or a ceramic substrate 10 . The substrate 10 includes two opposite surfaces, one of which is used to contact the heating element in the communication product, and can be arranged between the substrate 10 and the heating element through a thermally conductive glue or a thermally conductive medium, so that the two are in thermal contact. The other surface of the base plate 10 is used for mounting the plurality of tooth...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



