Blackened surface treated copper foil and copper foil with carrier foil
A surface treatment and blackening technology, applied in electrolysis process, electroforming, etc., can solve the problem of contrast reduction
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example 1
[0055] example 1 : Blackened surface treatment copper foil
[0056] Production and evaluation of the blackened surface-treated copper foil were performed as follows.
[0057] (1) Production of electrolytic copper foil
[0058] As the copper electrolyte, a sulfuric acid copper sulfate solution with the composition shown below was used, a titanium rotating electrode with a surface roughness Ra of 0.20 μm was used as the cathode, and a DSA (dimensionally stable anode) was used as the anode. Density 55A / dm 2 Electrolysis was performed to obtain an electrolytic copper foil having a thickness of 12 μm. The maximum level difference (Wmax) of the waviness on the deposition surface of this electrodeposited copper foil was 0.8 μm, and the maximum level difference (Wmax) of the waviness on the electrode surface was 1.5 μm.
[0059]
[0060] ‐Copper concentration: 80g / L
[0061] ‐Free sulfuric acid concentration: 140g / L
[0062] ‐Bis (3-sulfopropyl) disulfide concentration: 30mg / ...
example 2
[0088] Production and evaluation of blackened surface-treated copper foil were performed in the same manner as in Example 1 except that the electrode surface side of the electrolytic copper foil was roughened black.
example 3
[0090] Preparation and evaluation of the copper foil with carrier foil provided with the blackened surface-treated copper foil were performed as follows.
[0091] (1) Production of carrier foil
[0092] As the copper electrolyte, a sulfuric acid copper sulfate solution with the composition shown below was used, a titanium rotating electrode with a surface roughness Ra of 0.20 μm was used as the cathode, and a DSA (dimensionally stable anode) was used as the anode. Density 55A / dm 2 Electrolysis was performed to obtain an electrolytic copper foil having a thickness of 12 μm as a carrier foil.
[0093]
[0094] ‐Copper concentration: 80g / L
[0095] ‐Free sulfuric acid concentration: 140g / L
[0096] ‐Bis (3-sulfopropyl) disulfide concentration: 30mg / L
[0097] ‐Diallyldimethylammonium chloride polymer concentration: 50mg / L
[0098] - Chlorine concentration: 40mg / L
[0099] (2) Formation of organic peeling layer
[0100] The electrode surface side of the acid-washed carrie...
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