Flexible double-faced package substrate and manufacturing method thereof

A technology of encapsulating substrates and double sides, applied in chemical instruments and methods, lamination devices, instruments, etc., can solve problems such as stickiness and affecting operation

Active Publication Date: 2017-05-24
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the adhesive sheet is in a semi-cured state, it will be sticky during subsequent high-temperature baking, which will affect the operation
[0014] Moreover, with the functionalization of smart cards, the single-sided packaging substrate can no longer meet the existing needs, so it is necessary to provide a flexible double-sided packaging substrate

Method used

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  • Flexible double-faced package substrate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Production: first use epoxy resin composition, impregnate 1080 glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain a prepreg adhesive sheet, and then bake the prepreg adhesive sheet at 190°C for 1.5 hours to obtain Completely cured cured sheet 10, then one side of the cured sheet 10 is first hot-pressed with an adhesive film 21 and then hot-pressed with a copper foil 31 and then cured, and then the other side of the cured sheet 10 is heated with another adhesive film 23 After pressing together, the whole material is punched, and finally the surface of the punched material's adhesive film 23 and another copper foil 33 are hot-pressed and then cured to make a double-interface application. The flexible double-sided packaging substrate 1.

Embodiment 2

[0049]Production: first use epoxy resin composition, impregnate 2116 glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain a prepreg adhesive sheet, and then bake the prepreg adhesive sheet at 190°C for 1.5 hours to obtain Completely cured cured sheet 10, then heat press one side of the cured sheet 10 with an adhesive film 21 first, then hot press with copper foil 31 and then cure, and then hot press the other side of the cured sheet 10 with another adhesive film 23 After being combined together, the material is punched as a whole, and finally the surface of the glued film 23 of the punched material is combined with another copper foil 33 by hot pressing and post-cured to make a double-interface application. Flexible double-sided packaging substrate 1.

Embodiment 3

[0051] Production: first use epoxy resin composition, impregnate 3313 glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain a prepreg adhesive sheet, and then bake the prepreg adhesive sheet at 190°C for 1.5 hours to obtain Completely cured cured sheet 10, then heat press one side of the cured sheet 10 with an adhesive film 21 first, then hot press with copper foil 31 and then cure, and then hot press the other side of the cured sheet 10 with another adhesive film 23 After being combined together, the material is punched as a whole, and finally the surface of the glued film 23 of the punched material is combined with another copper foil 33 by hot pressing and post-cured to make a double-interface application. Flexible double-sided packaging substrate 1.

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Abstract

The invention relates to the field of smart card manufacturing, in particular to a flexible double-faced package substrate. The flexible double-faced package substrate comprises a mutually-compressed cured piece, two adhesive films and two copper foils, wherein the adhesive films are located on two sides of the cured piece respectively, the two copper foils are located on the adhesive films respectively, and through holes are formed in the cured piece, the two adhesive films and one copper foil. The invention further provides a method for manufacturing the flexible double-faced package substrate. The flexible double-faced package substrate is not sticky and does not influence operation during follow-up and high-temperature baking and can meet double-interface application.

Description

technical field [0001] The invention relates to the field of smart card production, in particular to a flexible double-sided packaging substrate and a preparation method thereof. Background technique [0002] Smart cards have shown their advantages in more and more fields. Their high reliability and the characteristics of not easy to lose information make them gradually replace magnetic cards in many occasions, such as bank cards and social security cards. [0003] A chip packaging step (i.e. IC packaging) is required in the smart card production process, and the PCB board used to carry the chip is the package carrier board. The production of the packaging substrate can be a panel-panel (that is, a board-by-board packaging) process, or a roll-roll (that is, a roll-to-roll packaging) process, and the latter undoubtedly has higher production efficiency. The base material used for roll-roll process production is the flexible substrate. [0004] Flexible substrates can bring a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02B32B17/06B32B15/20B32B27/04B32B27/38B32B3/24B32B7/10B32B7/08B32B7/06B32B33/00B32B37/12B32B37/10B32B37/06B32B38/16B32B38/04G06K19/077
CPCB32B3/266B32B7/06B32B7/08B32B7/10B32B15/14B32B15/20B32B33/00B32B37/06B32B37/10B32B37/12B32B38/04B32B38/164B32B2038/042B32B2260/021B32B2260/046B32B2262/101B32B2425/00G06K19/07722G06K19/07724
Inventor 汪青刘东亮
Owner GUANGDONG SHENGYI SCI TECH
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