36results about How to "Meet the needs of packaging" patented technology

The Cu-W film coating integrated composite heat sink comprises an oxygen-free copper matrix 1 with deposed 8 mum-15 mum Cu-W film 2 that composes by 8.1-17.5wt% Cu and W. This invention matches semiconductor chip on thermal expansion, can avoid damage to the chip, and satisfies the request of high-power semiconductor laser to improve the laser lifetime greatly.

The invention belongs to the technical field of bonding wire materials, and relates to a high- platinum-metal-content silver-palladium bonding wire and a preparation process thereof. The silver-platinum bonding wire comprises the following composition components of silver, platinum, copper, calcium, chromium, and other doped elements of indium, lanthanum, and iridium. Use of silver metal in combination with platinum metal helps to enhance strength and improve elongation of the wire, tensile force and thrust can meet the corresponding requirements, excellent welding performance and mechanical properties are achieved, during a preparation process, alloys are adopted for separate casting, a layer of platinum-silver alloy layer is further plated, in addition, the process of refining the wire and corresponding uniform annealing treatment are conducted, so that the bonding material with high radian, long span, good tensile force and large thrust can be formed, and the requirements of applications to in-line LED packaging, discrete devices, chip packaging and common integrated circuit packaging can be met.

The invention relates to the field of smart card manufacturing, in particular to a flexible double-faced package substrate. The flexible double-faced package substrate comprises a mutually-compressed cured piece, two adhesive films and two copper foils, wherein the adhesive films are located on two sides of the cured piece respectively, the two copper foils are located on the adhesive films respectively, and through holes are formed in the cured piece, the two adhesive films and one copper foil. The invention further provides a method for manufacturing the flexible double-faced package substrate. The flexible double-faced package substrate is not sticky and does not influence operation during follow-up and high-temperature baking and can meet double-interface application.

The invention discloses a steel pipe discharging packaging production line and belongs to the field of steel pipe discharging equipment. The steel pipe discharging packaging production line comprisesa conveying chain. Multiple hanging tools are arranged at the lower ends of the two sides of the conveying chain, and lifting hooks are arranged at the lower ends of the hanging tools. Steel pipes arehung at the lower ends of the lifting hooks, and packaging assemblies are arranged at the discharging end of the conveying chain. An unhooking assembly is arranged at the end, close to each packagingassembly, of the conveying chain. Each unhooking assembly comprises a rotating plate. The upper ends of the rotating plates are hinged to a fixing device of a production line, and the lower ends of the rotating plates are fixedly provided with unhooking air cylinders. Push plates are arranged on output shafts of the unhooking air cylinders, the push plates are arranged corresponding to the uppermiddle ends of the lifting hooks, the push plates are arranged on the inner sides of the lifting hooks, and the moving direction of the push plates is perpendicular to the side faces of the lifting hooks. By means of the steel pipe discharging packaging production line, automatic discharging of the steel pipes can be achieved, the labor intensity is lowered, and the work efficiency is improved.

The invention provides a chain plate type cleaning device and part cleaning equipment, and relates to the field of part cleaning, the chain plate type cleaning device comprises a chain plate conveying mechanism and a cleaning component, the intermittently moving chain plate conveying mechanism is provided with a plurality of positioning blocks at equal intervals in the moving direction, and the cleaning component is located above the chain plate conveying mechanism; the cleaning component comprises a cleaning mechanism, a drying mechanism and a cooling mechanism which are arranged in sequence, double-layer partition plates are arranged between the cleaning mechanism and the drying mechanism and between the drying mechanism and the cooling mechanism respectively, and part matching parts are arranged on the positioning blocks; in order to solve the problem that high-precision parts cannot be effectively cleaned by existing part cleaning equipment, a positioning block on a chain plate conveying mechanism can restrain the positions of the parts to be cleaned, the parts are conveyed into a cleaning area in a stable state, the postures of the parts can be matched with the positions of nozzles of cleaning components, and the cleaning effect is guaranteed; the position change of the part in the washing process is avoided, the posture of the part is kept, and damage to the part in the cleaning process is reduced.

The invention provides a packaging box molding machine applied to a full-automatic packaging line for an LED lamp tube. A rack (1) is provided with a feed bin base plate frame (2); a rail A (4) is arranged by the side of the feed bin base plate frame (2); a rail bearing A (3) is arranged at the top end of the rail A (4); the upper end of the rail A (4) is provided with a rail rod (5); a side plate(6) is arranged by the side of the rail rod (5); a servo control motor (8) is arranged at the side of the rack (1) and is fixed to a servo control motor fixing frame (7); the rack is provided with avacuum sucking disc rotation control cylinder fixing frame (9) and a packaging box tape adhering device; the packaging box tape adhering device can be used for sealing a packaging box in time so as toimprove the box sealing efficiency and meet the requirements of lamp tube machining and packaging under different working conditions; each molding machine can realize automatic feeding and discharging in an overall production line; and thus automatic matching and transmission can be implemented between the molding machines and the procedures.

The invention discloses an inclined light-emitting LED packaging structure which comprises a fixing support and a packaging support, the packaging support is movably embedded into the fixing support, a plurality of packaging fixing grooves are formed in the packaging support, each packaging fixing groove is connected with a plurality of 7-shaped inclined functional weld legs, each inclined functional weld leg comprises a packaging part, a first connecting part, a first fixing part and a first limiting part, the packaging part is vertically connected with one end of the first connecting part, the other end of the first connecting part is obliquely connected with one end part of the first fixing part, and the other end part of the first fixing part is connected with the first limiting part. The inclined light-emitting LED packaging structure has the advantages of simple structure, attractiveness, compactness and low cost.

The invention belongs to the field of LED packaging materials, and particularly relates to a small-spacing epoxy molding compound applied to an outdoor display screen and a preparation method thereof. The epoxy resin composition is prepared from the following raw materials in parts by weight: 50 parts of triglycidyl isocyanurate epoxy resin, 1-30 parts of a chain extender, 10-100 parts of a curing agent and 0.05-10 parts of an additive which comprises an adhesion promoter. The preparation method of the epoxy resin-based molding compound containing the triglycidyl isocyanurate structure epoxy resin capable of being applied to outdoor display small spacing is simple, process parameters are easy to control, no solvent is used in the manufacturing process, and the preparation method is a green and environment-friendly production and preparation process. The obtained low-light-decay epoxy resin-based plastic packaging material has the advantages of strong adhesion, high and low temperature impact resistance and reflow soldering resistance, and the light decay can meet the requirements of packaging of most white light LEDs.

According to the technical scheme, a special packaging device comprises paper; hollow words are printed on the paper; and the words can be Chinese characters or English letters or flower and bird patterns or combinations of the Chinese characters, the English letters and the flower and bird patterns. The packaging paper which can be selected by people freely is provided, can be processed and decorated to a certain extent according to the hobby of a user, is more unique, better conforms to characteristics of a gift and effectively meets the requirement of the user for gift packaging.