Small-spacing epoxy molding compound applied to outdoor display screen and preparation method thereof

A technology for epoxy molding compounds and outdoor display screens, applied in the direction of adhesive additives, triglycidyl isocyanurate adhesives, non-polymer adhesive additives, etc. LED packaging requirements, reducing the reliability of new high-power LEDs, low impact strength and other issues, to achieve the effects of easy control of process parameters, strong adhesion, and high and low temperature impact resistance

Active Publication Date: 2021-05-28
TECORE SYNCHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the traditional epoxy resin encapsulation material is easy to turn yellow under the action of short-wave radiation and high temperature, and it has defects such as brittle texture, low impact strength and easy cracking. Packaging requirements for power LEDs

Method used

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  • Small-spacing epoxy molding compound applied to outdoor display screen and preparation method thereof
  • Small-spacing epoxy molding compound applied to outdoor display screen and preparation method thereof
  • Small-spacing epoxy molding compound applied to outdoor display screen and preparation method thereof

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preparation example Construction

[0049]A second aspect of the invention provides a method of preparing a small spacing of an outdoor display screen as described above, including the following steps:

[0050](1) According to the weight, a trihydrate glyceride epoxide epoxide epoxy resin is tapered and stirred at 100-180 ° C for 0.5-1 hours; the temperature is adjusted to 60 ° C - 12 ° C, add curing agent, chain extender, and partial additive. , Mixed with mixing for 5-40 minutes, resulting in a mixture;

[0051](2) The mixture obtained by the incubation force promoter and partial additive is added, and the mixture obtained by the step (1) is added, and the temperature is adjusted to 60-100 ° C for 5-10 minutes, and the remaining additive is added, stirred for 1-8 minutes, discharge , Cool, pulverized cake.

[0052]The above method is prepared from the outdoor display small pitch containing a low-light attenuated epoxy-based plastic seal containing an epoxy resin of the isocyanic acid trihydrate.

[0053]The above-mentioned low-...

Embodiment 1

[0061]The formulation is shown in Table 1 (part of the weight), taking a trihydrate of cyanic acid trihydrate glyceride epoxide is stirred at 130 ° C for 1 hour; the temperature is adjusted to 60 ° C, add an anhydride, chain extender, and a silane coupling agent for 40 minutes. Mix is ​​uniform to give a mixture;

Embodiment 2

[0063]The formulation is shown in Table 1 (part of the weight), taking a trihydrate of cyanic acid trihydrate glycerylate epoxy resin is stirred at 120 ° C for 1 hour; the temperature is adjusted to 80 ° C, add an anhydride, chain extender, and a silane coupling agent for 40 minutes. Mix is ​​uniform to give a mixture;

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Abstract

The invention belongs to the field of LED packaging materials, and particularly relates to a small-spacing epoxy molding compound applied to an outdoor display screen and a preparation method thereof. The epoxy resin composition is prepared from the following raw materials in parts by weight: 50 parts of triglycidyl isocyanurate epoxy resin, 1-30 parts of a chain extender, 10-100 parts of a curing agent and 0.05-10 parts of an additive which comprises an adhesion promoter. The preparation method of the epoxy resin-based molding compound containing the triglycidyl isocyanurate structure epoxy resin capable of being applied to outdoor display small spacing is simple, process parameters are easy to control, no solvent is used in the manufacturing process, and the preparation method is a green and environment-friendly production and preparation process. The obtained low-light-decay epoxy resin-based plastic packaging material has the advantages of strong adhesion, high and low temperature impact resistance and reflow soldering resistance, and the light decay can meet the requirements of packaging of most white light LEDs.

Description

Technical field[0001]The present invention belongs to the field of LED package materials, and is specifically involved in an outdoor display small spacing epoxy seal and its preparation method thereof.Background technique[0002]As the development of the LED, the LED can issue a shorter wavelength. In order to create high performance, high-power or outdoor LED devices, the performance requirements of the LED chip package material are getting higher. The encapsulation material generally uses epoxy resin or silica gel, due to the shortcomings such as low refractive index of silica gel, small hardness, and poor moisture resistance. The use of epoxy resin thermosetting materials, high transparency, good mechanical resistance, corrosion resistance, low electrical properties, low cost, and high cross-linking density and high hardness, etc., can be used for LED and other devices.[0003]However, the traditional epoxy resin package material is easily yellowing under short-wave radiation and hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/06C09J11/06C08G59/42
CPCC09J163/06C09J11/06C08G59/4223C08K5/544Y02B20/00
Inventor 单秋菊谭晓华于会云孙绪筠
Owner TECORE SYNCHEM
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