High-platinum-metal-content silver-palladium bonding wire and preparation process thereof

A preparation process and bonding wire technology, which is applied in the field of silver-platinum bonding wire with high platinum content and its preparation process, can solve the problems of poor high-temperature oxidation resistance, easy migration of silver ions, and low tensile strength. Achieve the effect of improving plasticity and toughness, high radian and good tensile force

Active Publication Date: 2020-08-28
上杭县紫金佳博电子新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The cost of silver wire is lower than that of gold wire, and its bonding process does not require protective gas, so silver wire has become another bonding wire material to replace gold wire besides copper wire. With the high density and high speed of electronic packaging With the development of miniaturization, copper and silver bonding materials are gradually replacing gold bonding materials. However, copper bonding materials have problems such as high hardness, easy oxidation, and complicated processes. Silver bonding materials have low tensile strength and easy silver ions. Migration, poor high temperature oxidation resistance and easy corrosion

Method used

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  • High-platinum-metal-content silver-palladium bonding wire and preparation process thereof
  • High-platinum-metal-content silver-palladium bonding wire and preparation process thereof
  • High-platinum-metal-content silver-palladium bonding wire and preparation process thereof

Examples

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Effect test

Embodiment 1

[0028] A preparation process of silver-platinum bonding wire with high platinum content:

[0029] 1) Raw material pretreatment: wash the metal raw material, dry it for later use;

[0030] 2) Preparation of silver-platinum alloy: take 45% silver and 19.874% platinum metal and place them in a hydrogen atmosphere, dope with 0.08% indium element, carry out vacuum melting, the melting temperature is 1170°C, and water-cooled casting to obtain silver-platinum alloy;

[0031] 3) Preparation of silver-copper-chromium alloy: Take 20% silver, 0.05% copper and 0.007% chromium metal in an argon atmosphere, dope 0.003% iridium element, carry out vacuum melting, the melting temperature is 1700 ° C, and water-cooled casting to obtain silver copper chromium alloy;

[0032] 4) Preparation of silver-calcium alloy: Take 15% silver and 0.06% calcium metal in an argon atmosphere, dope with 0.003% lanthanum element, carry out vacuum melting, the melting temperature is 2650 ° C, and water-cooled cas...

Embodiment 2

[0037] A preparation process of silver-platinum bonding wire with high platinum content:

[0038] 1) Raw material pretreatment: wash the metal raw material, dry it for later use;

[0039] 2) Preparation of silver-platinum alloy: take 52% silver and 14.105% platinum metal and put them in a hydrogen atmosphere, dope with 0.006% indium element, carry out vacuum melting, the melting temperature is 1170°C, and water-cooled casting to obtain silver-platinum alloy;

[0040] 3) Preparation of silver-copper-chromium alloy: Take 21% silver, 0.2% copper and 0.01% chromium metal in an argon atmosphere, dope 0.007% iridium element, carry out vacuum melting, the melting temperature is 1750 ° C, and water-cooled casting to obtain silver copper chromium alloy;

[0041] 4) Preparation of silver-calcium alloy: Take 12.4% silver and 0.28% calcium metal in an argon atmosphere, dope with 0.008% lanthanum element, carry out vacuum melting, the melting temperature is 2700 ° C, and water-cooled cast...

Embodiment 3

[0046] A preparation process of silver-platinum bonding wire with high platinum content:

[0047] 1) Raw material pretreatment: wash the metal raw material, dry it for later use;

[0048] 2) Preparation of silver-platinum alloy: take 54% silver and 7.99% platinum metal and put them in a hydrogen atmosphere, dope with 0.08% indium element, carry out vacuum melting, the melting temperature is 1180°C, and water-cooled casting to obtain silver-platinum alloy;

[0049] 3) Preparation of silver-copper-chromium alloy: take 25% silver, 0.2% copper and 0.01% chromium metal in an argon atmosphere, dope 0.007% iridium element, carry out vacuum melting, the melting temperature is 1780 ° C, and water-cooled casting to obtain silver copper chromium alloy;

[0050] 4) Preparation of silver-calcium alloy: Take 15.55% silver and 0.23% calcium metal in an argon atmosphere, dope with 0.007% lanthanum element, carry out vacuum melting, the melting temperature is 2750 ° C, and water-cooled castin...

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Abstract

The invention belongs to the technical field of bonding wire materials, and relates to a high- platinum-metal-content silver-palladium bonding wire and a preparation process thereof. The silver-platinum bonding wire comprises the following composition components of silver, platinum, copper, calcium, chromium, and other doped elements of indium, lanthanum, and iridium. Use of silver metal in combination with platinum metal helps to enhance strength and improve elongation of the wire, tensile force and thrust can meet the corresponding requirements, excellent welding performance and mechanical properties are achieved, during a preparation process, alloys are adopted for separate casting, a layer of platinum-silver alloy layer is further plated, in addition, the process of refining the wire and corresponding uniform annealing treatment are conducted, so that the bonding material with high radian, long span, good tensile force and large thrust can be formed, and the requirements of applications to in-line LED packaging, discrete devices, chip packaging and common integrated circuit packaging can be met.

Description

technical field [0001] The invention belongs to the technical field of bonding wire materials, and in particular relates to a silver-platinum bonding wire material containing high platinum metal and a preparation process thereof. Background technique [0002] Due to its excellent chemical stability, bonding alloy materials are widely used in the integrated circuit packaging industry and LED industry. After years of research and development, the development of bonding gold wire materials has reached its limit. Nowadays, it has excellent performance and low price. Alloy wire materials have become a research and development trend. [0003] The requirements for raw materials used in the integrated circuit packaging industry and the LED industry are getting higher and higher, and they need to have excellent mechanical properties, electrical properties, oxidation resistance, and bonding properties. [0004] The price of bonding gold wire is expensive, so it is the current develop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C5/06C22C1/02C22F1/02C22F1/14B21C37/04
CPCB21C37/047C22C1/02C22C5/06C22F1/02C22F1/14
Inventor 周钢
Owner 上杭县紫金佳博电子新材料科技有限公司
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