Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A silver-platinum bonding wire material containing high platinum metal and its preparation process

A preparation process and bonding wire technology, which is applied in the field of silver-platinum bonding wire with high platinum content and its preparation process, can solve the problems of poor high-temperature oxidation resistance, easy migration of silver ions, and low tensile strength. Achieve the effect of improving plasticity and toughness, high radian and good tensile force

Active Publication Date: 2021-07-09
上杭县紫金佳博电子新材料科技有限公司
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The cost of silver wire is lower than that of gold wire, and its bonding process does not require protective gas, so silver wire has become another bonding wire material to replace gold wire besides copper wire. With the high density and high speed of electronic packaging With the development of miniaturization, copper and silver bonding materials are gradually replacing gold bonding materials. However, copper bonding materials have problems such as high hardness, easy oxidation, and complicated processes. Silver bonding materials have low tensile strength and easy silver ions. Migration, poor high temperature oxidation resistance and easy corrosion

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A silver-platinum bonding wire material containing high platinum metal and its preparation process
  • A silver-platinum bonding wire material containing high platinum metal and its preparation process
  • A silver-platinum bonding wire material containing high platinum metal and its preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A preparation process of silver-platinum bonding wire with high platinum content:

[0029] 1) Raw material pretreatment: wash the metal raw material, dry it for later use;

[0030] 2) Preparation of silver-platinum alloy: take 45% silver and 19.874% platinum metal and place them in a hydrogen atmosphere, dope with 0.08% indium element, carry out vacuum melting, the melting temperature is 1170°C, and water-cooled casting to obtain silver-platinum alloy;

[0031] 3) Preparation of silver-copper-chromium alloy: Take 20% silver, 0.05% copper and 0.007% chromium metal in an argon atmosphere, dope 0.003% iridium element, carry out vacuum melting, the melting temperature is 1700 ° C, and water-cooled casting to obtain silver copper chromium alloy;

[0032] 4) Preparation of silver-calcium alloy: Take 15% silver and 0.06% calcium metal in an argon atmosphere, dope with 0.003% lanthanum element, carry out vacuum melting, the melting temperature is 2650 ° C, and water-cooled cas...

Embodiment 2

[0037] A preparation process of silver-platinum bonding wire with high platinum content:

[0038] 1) Raw material pretreatment: wash the metal raw material, dry it for later use;

[0039] 2) Preparation of silver-platinum alloy: take 52% silver and 14.105% platinum metal and put them in a hydrogen atmosphere, dope with 0.006% indium element, carry out vacuum melting, the melting temperature is 1170°C, and water-cooled casting to obtain silver-platinum alloy;

[0040] 3) Preparation of silver-copper-chromium alloy: Take 21% silver, 0.2% copper and 0.01% chromium metal in an argon atmosphere, dope 0.007% iridium element, carry out vacuum melting, the melting temperature is 1750 ° C, and water-cooled casting to obtain silver copper chromium alloy;

[0041] 4) Preparation of silver-calcium alloy: Take 12.4% silver and 0.28% calcium metal in an argon atmosphere, dope with 0.008% lanthanum element, carry out vacuum melting, the melting temperature is 2700 ° C, and water-cooled cast...

Embodiment 3

[0046] A preparation process of silver-platinum bonding wire with high platinum content:

[0047] 1) Raw material pretreatment: wash the metal raw material, dry it for later use;

[0048] 2) Preparation of silver-platinum alloy: take 54% silver and 7.99% platinum metal and put them in a hydrogen atmosphere, dope with 0.08% indium element, carry out vacuum melting, the melting temperature is 1180°C, and water-cooled casting to obtain silver-platinum alloy;

[0049] 3) Preparation of silver-copper-chromium alloy: take 25% silver, 0.2% copper and 0.01% chromium metal in an argon atmosphere, dope 0.007% iridium element, carry out vacuum melting, the melting temperature is 1780 ° C, and water-cooled casting to obtain silver copper chromium alloy;

[0050] 4) Preparation of silver-calcium alloy: Take 15.55% silver and 0.23% calcium metal in an argon atmosphere, dope with 0.007% lanthanum element, carry out vacuum melting, the melting temperature is 2750 ° C, and water-cooled castin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
elongationaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of bonding wire materials, and relates to a silver-platinum bonding wire material containing high platinum metal and a preparation process thereof. The composition of the silver-platinum bonding wire includes silver, platinum, copper, calcium, chromium, and other doping elements indium, lanthanum, and iridium; the use of silver metal in combination with platinum metal helps to enhance the strength and elongation of the wire The increase in tension and thrust can meet the corresponding requirements, and it has excellent welding performance and mechanical properties. The wire material and the corresponding uniform annealing treatment form a bonding material with high radian, long span, good tensile force and large thrust force, which can meet the requirements of in-line LED packaging, discrete devices, chip packaging and ordinary integrated circuit packaging. demand.

Description

technical field [0001] The invention belongs to the technical field of bonding wire materials, and in particular relates to a silver-platinum bonding wire material containing high platinum metal and a preparation process thereof. Background technique [0002] Due to its excellent chemical stability, bonding alloy materials are widely used in the integrated circuit packaging industry and LED industry. After years of research and development, the development of bonding gold wire materials has reached its limit. Nowadays, it has excellent performance and low price. Alloy wire materials have become a research and development trend. [0003] The requirements for raw materials used in the integrated circuit packaging industry and the LED industry are getting higher and higher, and they need to have excellent mechanical properties, electrical properties, oxidation resistance, and bonding properties. [0004] The price of bonding gold wire is expensive, so it is the current develop...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/06C22C1/02C22F1/02C22F1/14B21C37/04
CPCB21C37/047C22C1/02C22C5/06C22F1/02C22F1/14
Inventor 周钢
Owner 上杭县紫金佳博电子新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com